Method of forming an electrically conductive line in an integrated circuit

1. A method of forming a semiconductor structure, comprising:

providing a semiconductor substrate comprising a layer of a dielectric material provided over an electrically conductive feature, said layer of dielectric material comprising an opening being located over said electrically conductive feature;

performing a first etching process to form a recess in said electrically conductive feature, said first etching process being adapted to remove a material of the electrically conductive feature;

forming a protective layer over a first portion of said recess, a second portion of said recess not being covered by said protective layer; and

performing a second etching process, said second etching process being adapted to remove the material of the electrically conductive feature at a greater etch rate than a material of the protective layer.

2. The method of claim 1 , wherein a degree of anisotropy of said first etching process is greater than a degree of anisotropy of said second etching process.

3. The method of claim 1 , wherein said first etching process is an anisotropic etching process.

4. The method of claim 1 , wherein said second etching process is an isotropic etching process.

5. The method of claim 1 , wherein said first portion of said recess comprises a sidewall of said recess and wherein said second portion of said recess comprises a bottom of said recess.

6. The method of claim 1 , wherein said formation of said protective layer comprises:

depositing a material layer comprising the material of the protective layer over said semiconductor structure;

performing an anisotropic etching process adapted to remove a portion of the material layer located over the second portion of the recess at a greater etch rate than a portion of the material layer located over the first portion of the recess; and

stopping said anisotropic etching process upon removal of said portion of said material layer located over said second portion of said recess.

7. A method of forming a semiconductor structure, comprising:

providing a semiconductor substrate comprising at least one layer of a dielectric material provided over an electrically conductive feature;

forming an opening in said at least one layer of dielectric material, said opening having a first portion and a second portion, said second portion being located at a greater distance from said electrically conductive feature than said first portion, said first portion having a first dimension in a lateral direction, said lateral direction being substantially parallel to a surface of said layer of dielectric material, said second portion having a second dimension in said lateral direction, said first dimension being greater than said second dimension, wherein said formation of said opening comprises:

performing a first etching process to form said second portion of said opening;

forming a protective layer over a sidewall of said second portion of said opening, at least a portion of a bottom of the second portion of the opening not being covered by said protective layer; and

performing a second etching process to form said first portion of said opening, said second etching process being adapted to remove a material of said at least one layer of dielectric material at a greater etch rate than a material of said protective layer; and

filling said opening with an electrically conductive material.

8. The method of claim 7 , wherein a degree of anisotropy of said first etching process is greater than a degree of anisotropy of said second etching process.

9. The method of claim 7 , wherein said first etching process is anisotropic and said second etching process is isotropic.

10. The method of claim 7 , wherein said formation of said protective layer comprises:

isotropically depositing a material layer comprising a material of said protective layer over said semiconductor substrate;

performing an anisotropic etching process adapted to remove a first portion of said material layer located over said sidewall of said second portion of said second opening at a smaller etch rate than a second portion of said material layer located on said bottom of said second portion of said opening; and

stopping said anisotropic etching process upon a removal of said second portion of said material layer.

11. The method of claim 7 , wherein said at least one layer of dielectric material comprises a first layer of dielectric material and a second layer of dielectric material, said first layer of dielectric material being formed over said electrically conductive feature, said second layer of dielectric material being formed over said first layer of dielectric material, and wherein said formation of said opening comprises:

performing a first etching process to form said second portion of said opening in said second layer of dielectric material; and

after said first etching process, performing a second etching process to form said first portion of said opening in said first layer of dielectric material, wherein said second etching process is adapted to remove a material of said first layer of dielectric material, leaving said second layer of dielectric material substantially intact.

12. The method of claim 11 , wherein a degree of anisotropy of said first etching process is greater than a degree of anisotropy of said second etching process.

13. The method of claim 11 , wherein said first etching process is anisotropic and said second etching process is isotropic.

14. A method of forming a semiconductor structure, comprising:

providing a semiconductor substrate comprising at least one layer of a dielectric material provided over an electrically conductive feature;

forming an opening in said at least one layer of dielectric material, said opening having a first portion and a second portion, said second portion being located at a greater distance from said electrically conductive feature than said first portion, said first portion having a first dimension in a lateral direction, said lateral direction being substantially parallel to a surface of said layer of dielectric material, said second portion having a second dimension in said lateral direction, said first dimension being greater than said second dimension, wherein said at least one layer of dielectric material comprises a first layer of dielectric material and a second layer of dielectric material, said first layer of dielectric material being formed over said electrically conductive feature, said second layer of dielectric material being formed over said first layer of dielectric material, and wherein said formation of said opening comprises:

performing a first etching process to form said second portion of said opening in said second layer of dielectric material; and

after said first etching process, performing a second etching process to form said first portion of said opening in said first layer of dielectric material, wherein said second etching process is adapted to remove a material of said first layer of dielectric material, leaving said second layer of dielectric material substantially intact; and

filling said opening with an electrically conductive material.

15. The method of claim 14 , wherein a degree of anisotropy of said first etching process is greater than a degree of anisotropy of said second etching process.

16. The method of claim 14 , wherein said first etching process is anisotropic and said second etching process is isotropic.