High-frequency power amplifier
A high-frequency power amplifier has an FET element having a unit FETs in multifinger form, and having a gate pad through which a signal is input, a source pad that is grounded, and a drain pad through which a signal is output. A high-frequency processing circuit includes series resonance circuits shunt-connected between the gate pads of the unit FETs and grounding ends. Two of the series resonance circuits have respective different resonance frequencies which correspond to second and higher harmonics of a frequency included in the operating frequency band of the FET element.
1. A high-frequency power amplifier comprising:
a transistor element having a plurality of unit transistors on a first semiconductor substrate, each of the unit transistors having a plurality of transistors connected in parallel with each other in multifinger form, and each of the unit transistors having a control terminal through which an input signal is input, a first terminal connected to a constant-potential end, and a second terminal through which an output signal is output;
a high-frequency processing circuit having a plurality of first series resonance circuits shunt-connected between the control terminals of the unit transistors of the transistor element and the constant-potential ends, and located on a second semiconductor substrate;
a first connection line connecting the plurality of control terminals of the transistor element to each other;
a second connection line connecting the plurality of second terminals of the transistor element to each other;
an input matching circuit connected to the first connection line; and
an output matching circuit connected to the second connection line, wherein two of the first series resonance circuits have respective different resonance frequencies corresponding to second and higher harmonics of respective frequencies that are included in an operating frequency band of the transistor element.
2. The high-frequency power amplifier according to claim 1 , wherein one of the first series resonance circuits is connected to each of the unit transistors.
3. The high-frequency power amplifier according to claim 1 , wherein the number of respective resonance frequencies different from each other in the first series resonance circuits is an integer factor of the number of unit transistors in the transistor element.
4. The high-frequency power amplifier according to claim 1 further comprising a plurality of second series resonance circuits on the second semiconductor substrate, shunt-connected between the control terminal of the unit transistor and the constant-potential end, in parallel with the first series resonance circuit, wherein two of the second series resonance circuits have respective different resonance frequencies corresponding to second and higher harmonics of respective frequencies included in the operating frequency band of the transistor element.
5. The high-frequency power amplifier according to claim 4 , wherein the number of the resonance frequencies different from each other in the second series resonance circuits is an integer factor of the number of the unit transistors in the transistor elements.
6. The high-frequency power amplifier according to claim 1 , wherein the first semiconductor substrate and the second semiconductor substrate are integral with each other.
7. A high-frequency power amplifier comprising:
a transistor element having a plurality of unit transistors on a first semiconductor substrate, each of the unit transistors having a plurality of bipolar transistors connected in parallel with each other in multifinger form, and each of the unit transistors having a control terminal through which an input signal is input, a first terminal connected to a constant-potential end, and a second terminal through which an output signal is output;
a high-frequency processing circuit having a plurality of first series resonance circuits shunt-connected between the control terminals of the unit transistors of the transistor element and the constant-potential ends, and located on a second semiconductor substrate;
a first connection line connecting the plurality of control terminals of the transistor element to each other;
a second connection line connecting the plurality of second terminals of the transistor element to each other;
an input matching circuit connected to the first connection line; and
an output matching circuit connected to the second connection line, wherein the first series resonance circuits have respective resonance frequencies corresponding to second or higher harmonics of respective frequencies included in an operating frequency band of the transistor element.
8. The high-frequency power amplifier according to claim 7 , wherein the first semiconductor substrate and the second semiconductor substrate are integral with each other.