Method of manufacturing a dielectric component, and dielectric components manufactured by such a method
View Patent ↗A method of forming a dielectric component, such as a capacitor is disclosed. In such a method, a conductive surface is applied to a dielectric to form a coated dielectric. Then a portion of the conductive surface is removed from the coated dielectric to form at least two electrically isolated conductive areas.
1. A method of forming a capacitor, comprising:
applying a conductive surface to a curved surface of a dielectric to form a coated dielectric; and
removing a portion of the conductive surface from the coated dielectric to form at least two electrically isolated conductive areas, wherein removing a portion of the conductive surface includes:
placing a deposition object proximate to the portion of the conductive surface to be removed;
electrically connecting the coated dielectric to a voltage source in order to make the coated dielectric an anode;
electrically connecting the deposition object to a voltage source in order to make the deposition object a cathode;
permitting a portion of the conductive surface from the coated dielectric to deposit on the deposition object.
2. The method of claim 1 , wherein applying the conductive surface includes electro-plating.
3. The method of claim 2 , wherein electro-plating is carried out by:
placing the dielectric material in an electrolyte;
electrically connecting the dielectric to a voltage source in order to make the dielectric a cathode;
placing a conductive material in the electrolyte;
electrically connecting the conductive material to a voltage source in order to make the conductive material an anode;
permitting the conductive material to deposit on the dielectric material.
4. The method of claim 1 , wherein the dielectric material is substantially annularly shaped.
5. The method of claim 4 , wherein one of the conductive areas resides at least in part on an inner curved surface of the dielectric material.
6. The method of claim 4 , wherein one of the conductive areas resides at least in part on an outer curved surface of the dielectric material.
7. The method of claim 4 , wherein a first one of the conductive areas covers a portion of an inner curved surface of the dielectric material and also a portion of an outer curved surface of the dielectric material.
8. The method of claim 7 , wherein a second one of the conductive areas covers a portion of the inner curved surface of the dielectric material and also a portion of the outer curved surface of the dielectric material.
9. The method of claim 4 , wherein one of the conductive areas resides on a substantially flat portion of the dielectric material.
10. The method of claim 9 , wherein another of the conductive areas resides on a substantially flat portion of the dielectric material.