IP Library › Assignment 029777/0130
Patent Assignment
Reel/Frame 029777/0130

Patent Security Agreement

Recorded: 2013-02-07 Pages: 12
Assignors
SPECTRUM MICROWAVE, INC.
Executed: 2013-02-06
API CRYPTEK INC.
Executed: 2013-02-06
API DEFENSE, INC.
Executed: 2013-02-06
SPECTRUM CONTROL, INC.
Executed: 2013-02-06
NATIONAL HYBRID, INC.
Executed: 2013-02-06
Assignee
GUGGENHEIM CORPORATE FUNDING, LLC
135 EAST 57TH STREET, 6TH FLOOR, NEW YORK, NEW YORK, 10022
Covered Properties (49)
Self-Aligning Print Head Assembly with Advanced Shielding Characteristics
Patent: 4,954,839 →
Application: 07/383,436 →
Electrical Connector with Tape Filter
Patent: 5,277,625 →
Application: 07/971,028 →
Tape Filter and Method of Applying Same to an Electrical Connector
Patent: 5,269,705 →
Application: 07/971,164 →
Pi Signal Frequency Filter Method of Manufacture
Patent: 5,701,665 →
Application: 08/005,701 →
Rf Filter Having Composite Dielectric Layer and Method of Manufacture
Patent: 5,382,928 →
Application: 08/008,277 →
Filtered Electrical Connector
Patent: 5,340,334 →
Application: 08/093,832 →
Emi Protected Tap Connector
Patent: 5,399,099 →
Application: 08/105,540 →
Hybrid Circuits and a Method of Manufacture
Patent: 5,378,313 →
Application: 08/171,696 →
Electrical Connector Having a Device Retaining Means and a Method of Assembly Thereof
Patent: 5,511,994 →
Application: 08/278,489 →
Multiposition Electrical Connector Filter Adapter
Patent: 5,562,499 →
Application: 08/380,485 →
Esd and Emi Protected Ethernet Lan Tap
Patent: 5,620,341 →
Application: 08/415,891 →
Modular Connector Assembly Having Removable Contacts
Patent: 5,647,766 →
Application: 08/451,331 →
Filtered Electrical Connector
Patent: 5,580,280 →
Application: 08/497,010 →
Shielding Gasket
Patent: 5,578,790 →
Application: 08/524,193 →
Inverted Chip Bonded Module with High Packaging Efficiency
Patent: 5,627,406 →
Application: 08/689,388 →
Inverted Chip Bonded Module with High Packaging Efficiency
Patent: 5,866,441 →
Application: 08/767,160 →
Inverted Chip Bonded Module with High Packaging Efficiency
Patent: 5,793,105 →
Application: 08/811,114 →
Filtered Terminal Block Assembly
Patent: 5,895,293 →
Application: 08/842,122 →
Filtered Electrical Adapter and Connector
Patent: 5,827,092 →
Application: 08/882,249 →
Package for Power Semiconductor Chips
Patent: 5,904,499 →
Application: 08/906,045 →
Circuit Including a Corral for Containing a Protective Coating, and Method of Making Same
Patent: 5,920,112 →
Application: 09/056,306 →
Apparatus for the Photodynamic Treatment of Living Beings or Organs Thereof
Patent: 6,146,410 →
Application: 09/077,066 →
Multi-Level Security Network System
Patent: 6,304,973 →
Application: 09/129,879 →
A Method of Making a Circuit Including a Corral for Containing a Protective Coating
Patent: 6,159,869 →
Application: 09/218,148 →
Method of Encapsulating a Saw Device
Patent: 6,182,342 →
Application: 09/285,410 →
Package for Electronic Devices
Patent: 6,165,820 →
Application: 09/311,081 →
Optocoupler Package Being Hermetically Sealed
Patent: 6,388,264 →
Application: 09/633,631 →
Interconnection Method Entailing Protuberances Formed by Melting Metal Over Contact Areas
Patent: 6,613,605 →
Application: 09/737,408 →
Publication: US 2003/0124829
Module with Bumps for Connection and Support
Patent: 6,614,110 →
Application: 09/745,966 →
Multi-Level Security Network System
Patent: 7,069,437 →
Application: 09/933,760 →
Publication: US 2003/0005331
Virtual Data Labeling and Policy Manager System and Method
Patent: 6,950,824 →
Application: 10/156,805 →
Virtual Data Labeling System and Method
Patent: 6,931,411 →
Application: 10/157,231 →
Interconnection Method
Patent: 7,132,356 →
Application: 10/650,265 →
Low Profile Filter
Patent: 6,822,845 →
Application: 10/692,131 →
Publication: US 2004/0084199
Digital Integration Method
Patent: 7,421,353 →
Application: 10/718,169 →
System and Method for Traversing Metadata Across Multiple Network Domains at Various Layers of the Protocol Stack
Patent: 7,561,578 →
Application: 10/987,303 →
Publication: US 2005/0122979
High Density Electronic Interconnection
Patent: 7,271,028 →
Application: 10/989,882 →
Dielectric Component Array with Failsafe Link
Patent: 7,295,086 →
Application: 11/079,310 →
Publication: US 2005/0195048
Method of Manufacturing a Dielectric Component, and Dielectric Components Manufactured by Such a Method
Patent: 7,611,617 →
Application: 11/685,050 →
Publication: US 2007/0285874
Method and Systems for Dynamically Providing Communities of Interest on an End User Workstation
Patent: 8,689,292 →
Application: 12/106,917 →
Publication: US 2009/0328170
Axial Dielectric Component Array And Method
Application: 12/116,776 →
Publication: US 2009/0066445
Electromagnetic Filter with a Conductive Clip Retention System and Method of Assembly
Patent: 8,289,105 →
Application: 12/202,215 →
Publication: US 2009/0140826
Stepped Radome and Antenna Having a Stepped Radome
Patent: 8,179,335 →
Application: 12/398,046 →
Publication: US 2009/0224997
System and Method for Traversing Metadata Across Multiple Network Domains at Various Layers of the Protocol Stack
Patent: 7,990,884 →
Application: 12/458,465 →
Publication: US 2010/0074260
Mandevilla Lindl Plant Named 'TSURUMARUNOAKA5155'
Patent: 21,866 →
Application: 12/458,645 →
Publication: US 2010/0031406
Antenna With High K Backing Material
Patent: 8,810,474 →
Application: 12/616,767 →
Publication: US 2010/0141542
Multi-Section Velocity Compensated Microstrip Directional Coupler
Patent: 8,587,388 →
Application: 12/703,500 →
Publication: US 2010/0225416
Aiming Device for a Bomb Disarming Disruptor
Patent: 8,960,542 →
Application: 12/792,174 →
Publication: US 2012/0180366
Intelligent DC Power Management System
Application: 13/208,279 →
Publication: US 2012/0046794
Related Assignments (12)
Other recorded transfers of the patents in this record — the chain of ownership.
Release of Security Interest Jun 25, 2012
From: MORGAN STANLEY SENIOR FUNDING, INC AS COLLATERAL AGENT
To: NATIONAL HYBRID, INC.
Reel/Frame 028439/0573 →
Release of Security Interest Feb 6, 2013
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: SPECTRUM MICROWAVE, INC.
Reel/Frame 029767/0683 →
Release of Security Interest Feb 6, 2013
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: API CRYPTEK, INC.
Reel/Frame 029767/0651 →
Release of Security Interest Feb 6, 2013
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: SPECTRUM CONTROL, INC.
Reel/Frame 029767/0583 →
Release of Security Interest Mar 21, 2014
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS AGENT
To: API DEFENSE, INC.; NATIONAL HYBRID, INC.; API CRYPTEK INC.; SPECTRUM CONTROL, INC.
Reel/Frame 032501/0458 →
Release of Security Interest Jun 29, 2015
From: PNC BANK, NATIONAL ASSOCIATION
To: SPECTRUM CONTROL,INC.
Reel/Frame 035925/0186 →
Release of Security Interest Apr 22, 2016
From: GUGGENHEIM CORPORATE FUNDING, LLC, AS AGENT
To: API DEFENSE, INC.; NATIONAL HYBRID, INC.; API CRYPTEK INC.; SPECTRUM CONTROL, INC.
Reel/Frame 038502/0459 →
Security Interest Apr 22, 2016
From: API TECHNOLOGIES CORP.; SPECTRUM CONTROL, INC.; SPECTRUM MICROWAVE, INC.; API DEFENSE, INC.
To: BNP PARIBAS, AS COLLATERAL AGENT
Reel/Frame 038351/0207 →
Release of Security Interest Apr 20, 2018
From: BNP PARIBAS, AS COLLATERAL AGENT
To: SPECTRUM CONTROL, INC.
Reel/Frame 045603/0923 →
Release of Security Interest Apr 20, 2018
From: BNP PARIBAS, AS COLLATERAL AGENT
To: SPECTRUM MICROWAVE, INC.
Reel/Frame 045603/0472 →
Security Interest Apr 20, 2018
From: API TECHNOLOGIES CORP.; SPECTRUM CONTROL, INC.; SPECTRUM MICROWAVE, INC.
To: ANTARES CAPITAL LP, AS AGENT
Reel/Frame 045595/0601 →
Release of Security Interest May 9, 2019
From: ANTARES CAPITAL LP
To: API TECHNOLOGIES, CORP; SPECTRUM CONTROL, INC.; SPECTRUM MICROWAVE, INC.
Reel/Frame 049132/0139 →