IP Library › Assignment 028439/0573
Patent Assignment
Reel/Frame 028439/0573

Release of Security Interest

Recorded: 2012-06-25 Pages: 6
Assignor
Assignee
NATIONAL HYBRID, INC.
3285 VETERAN'S MEMORIAL HWY, SUITE A-7, A-10, RONKONKOMA, NEW YORK, 11779
Covered Properties (7)
Hybrid Circuits and a Method of Manufacture
Patent: 5,378,313 →
Application: 08/171,696 →
Inverted Chip Bonded Module with High Packaging Efficiency
Patent: 5,627,406 →
Application: 08/689,388 →
Inverted Chip Bonded Module with High Packaging Efficiency
Patent: 5,866,441 →
Application: 08/767,160 →
Inverted Chip Bonded Module with High Packaging Efficiency
Patent: 5,793,105 →
Application: 08/811,114 →
Package for Power Semiconductor Chips
Patent: 5,904,499 →
Application: 08/906,045 →
Package for Electronic Devices
Patent: 6,165,820 →
Application: 09/311,081 →
Module with Bumps for Connection and Support
Patent: 6,614,110 →
Application: 09/745,966 →
Related Assignments (2)
Other recorded transfers of the patents in this record — the chain of ownership.
Patent Security Agreement Feb 7, 2013
From: SPECTRUM MICROWAVE, INC.; API CRYPTEK INC.; API DEFENSE, INC.; SPECTRUM CONTROL, INC.
To: GUGGENHEIM CORPORATE FUNDING, LLC
Reel/Frame 029777/0130 →
Release of Security Interest Apr 22, 2016
From: GUGGENHEIM CORPORATE FUNDING, LLC, AS AGENT
To: API DEFENSE, INC.; NATIONAL HYBRID, INC.; API CRYPTEK INC.; SPECTRUM CONTROL, INC.
Reel/Frame 038502/0459 →