IP Library Granted Patent US 7,295,484
Granted Patent B2
US 7,295,484 · App. 11/685,419 · Granted Nov 13, 2007

Temperature based DRAM refresh

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Quick Facts
Patent No.
US 7,295,484
App. No.
11/685,419
Granted
Nov 13, 2007
Kind
B2
Abstract

A system for controlling the refresh cycles of a DRAM cell array based upon a temperature measurement. During active mode, a refresh request indication based on a measured temperature is provided to a DRAM controller (e.g. of another integrated circuit die), wherein the DRAM controller initiates a refresh cycle of the DRAM cell array in response thereto. In a self refreshing mode, the DRAM controller does not initiate refresh cycles, but refresh cycles are performed by a controller on the integrated circuit die of the array based upon a temperature measurement.

Claims (41)

1. An electronic system comprising:

a first integrated circuit die including:

an array of dynamic random access memory (DRAM) cells;

a temperature sensor;

refresh circuitry, the refresh circuitry for refreshing the DRAM cells of the array;

refresh determination circuitry operably coupled to the temperature sensor, the refresh determination circuitry for generating requests to initiate a refresh cycle to refresh the array based upon a measured temperature of the temperature sensor; and

an external output, the external output providing a refresh request indication externally from the first integrated circuit die, wherein the refresh request indication is indicative of a request to execute the refresh cycle of the array based upon the measured temperature of the temperature sensor; and

a second integrated circuit die including:

an input, the input coupled to receive the refresh request indication; and

control circuitry, wherein the control circuitry of the second integrated circuit die utilizes the received refresh request indication to initiate the refresh cycle of the array.

2. The electronic system of claim 1 wherein during a self refresh mode of operation, control circuitry of the first integrated circuit die initiates self refresh cycles of the array by the refresh circuitry.

3. The electronic system of claim 2 wherein during an active mode of operation, the first integrated circuit die provides the refresh request indication to indicate a request to execute a refresh cycle of the array, wherein the first integrated circuit die provides the refresh request indication to indicate a request to execute a refresh cycle of the array based upon a measured temperature of the temperature sensor.

4. The electronic system of claim 3 wherein during an active mode of operation, the second integrated circuit die provides data to the first integrated circuit die to be written in the array.

5. The electronic system of claim 1 wherein during a self refresh mode of operation, the first integrated circuit die does not provide the refresh request indication to request an execution of a refresh cycle.

6. The electronic system of claim 1 wherein the second integrated circuit die includes a programmable register, wherein the contents of the register are indicative of whether the control circuitry of the second integrated circuit die is responsive to the refresh request indication.

7. The electronic system of claim 1 wherein:

the external output includes a terminal of the first integrated circuit die and the refresh request indication includes an assertion of a signal provided by the terminal.

8. The electronic system of claim 1 further comprising:

a third integrated circuit die including:

a second array of dynamic random access memory (DRAM) cells;

a second temperature sensor;

refresh circuitry, the refresh circuitry for refreshing the DRAM cells of the second array;

a second external output, the second external output providing a second refresh request indication, wherein the second refresh request indication is indicative of a request to execute a refresh cycle of the second array based upon a measured temperature of the second temperature sensor.

9. The electronic system of claim 8 wherein the refresh request indication is carried on a first line and the second refresh request indication is carried on a second line, wherein the first line and the second line are hard wired together in a wired OR configuration.

10. An integrated circuit die including:

an array of dynamic random access memory (DRAM) cells;

a temperature sensor;

control circuitry;

refresh circuitry, the refresh circuitry for refreshing DRAM cells of the array;

refresh determination circuitry operably coupled to the temperature sensor, the refresh determination circuitry for generating requests to initiate a refresh cycle to refresh the array based upon a measured temperature of the temperature sensor; and

an external output, the external output providing a refresh request indication externally from the integrated circuit die, wherein the refresh request indication is indicative of a request to execute the refresh cycle of the array based upon the measured temperature of the temperature sensor.

11. The integrated circuit die of claim 10 further comprising:

a timer, wherein the refresh request indication is provided to indicate a refresh request based upon the timer.

12. The integrated circuit die of claim 10 wherein a rate of providing the refresh request indication to request a refresh request is based upon a measured temperature of the temperature sensor.

13. The integrated circuit die of claim 10 wherein the external output includes an external terminal, and wherein the refresh request indication includes a discrete signal asserted in a first state indicative of a request to execute a refresh cycle, the discrete signal having a second state indicative of no request to execute a refresh cycle.

14. The integrated circuit die of claim 10 wherein during a self refresh mode of operation, the control circuitry initiates self refresh cycles of the array by the refresh circuitry.

15. The integrated circuit die of claim 10 wherein during an active mode of operation, the external output provides the refresh request indication to indicate a request to execute a refresh cycle of the array, wherein the external output provides the refresh request indication to indicate a request to execute a refresh cycle of the array based upon a measured temperature of the temperature sensor.

16. The integrated circuit die of claim 15 wherein during a self refresh mode of operation, the external output does not provide the refresh request indication to request an execution of a refresh cycle.

17. The integrated circuit die of claim 15 wherein data read accesses and data write accesses can be made to the array during the active mode and data read accesses and data write accesses can not be made to the array during the self refresh mode.

18. The integrated circuit die of claim 15 wherein during the active mode, refresh cycles of the array are initiated by control circuitry located external to the die.

19. The electronic system of claim 3 wherein data read accesses and data write accesses can be made to the array during the active mode and data read accesses and data write accesses can not be made to the array during the self refresh mode.

Assignments (34)
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040925 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Feb 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V. F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 052917/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040928 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Jan 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 052915/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 7, 2020
From: VLSI TECHNOLOGY, LLC
To: NXP USA, INC.
Reel/Frame 051439/0567 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 037486 FRAME 0517. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Dec 10, 2019
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
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CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0387 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042762 FRAME 0145. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051145/0184 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051030/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042985 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050745/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050744/0097 →
CORRECTIVE ASSIGNMENT TO CORRECT THE TO CORRECT THE APPLICATION NO. FROM 13,883,290 TO 13,833,290 PREVIOUSLY RECORDED ON REEL 041703 FRAME 0536. ASSIGNOR(S) HEREBY CONFIRMS THE THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS.. Recorded Feb 20, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: SHENZHEN XINGUODU TECHNOLOGY CO., LTD.
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CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042985/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042762/0145 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE PATENTS 8108266 AND 8062324 AND REPLACE THEM WITH 6108266 AND 8060324 PREVIOUSLY RECORDED ON REEL 037518 FRAME 0292. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Feb 1, 2017
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CORRECTIVE ASSIGNMENT TO CORRECT THE NATURE OF CONVEYANCE LISTED CHANGE OF NAME SHOULD BE MERGER AND CHANGE PREVIOUSLY RECORDED AT REEL: 040652 FRAME: 0180. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER AND CHANGE OF NAME. Recorded Jan 12, 2017
From: FREESCALE SEMICONDUCTOR INC.
To: NXP USA, INC.
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CHANGE OF NAME Recorded Nov 8, 2016
From: FREESCALE SEMICONDUCTOR INC.
To: NXP USA, INC.
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RELEASE OF SECURITY INTEREST Recorded Nov 7, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 040928/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 21, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V., F/K/A FREESCALE SEMICONDUCTOR, INC.
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CORRECTION BY DECLARATION PATENT 7295484 Recorded Aug 31, 2016
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To: FREESCALE SEMICONDUCTOR INC.
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From: NXP B.V.
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SUPPLEMENT TO THE SECURITY AGREEMENT Recorded Jun 16, 2016
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To: MORGAN STANLEY SENIOR FUNDING, INC.
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SECURITY AGREEMENT SUPPLEMENT Recorded Mar 7, 2016
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PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
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PATENT RELEASE Recorded Dec 21, 2015
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PATENT RELEASE Recorded Dec 21, 2015
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To: FREESCALE SEMICONDUCTOR, INC.
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PATENT RELEASE Recorded Dec 21, 2015
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To: FREESCALE SEMICONDUCTOR, INC.
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CHANGE OF NAME Recorded Aug 7, 2015
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SECURITY AGREEMENT Recorded Nov 6, 2013
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SECURITY AGREEMENT Recorded May 13, 2010
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS COLLATERAL AGENT
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SECURITY AGREEMENT Recorded Jul 11, 2008
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SECURITY AGREEMENT Recorded Sep 19, 2007
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A.
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