Interposer structure with embedded capacitor structure, and methods of making same
View Patent ↗A device is disclosed which includes an interposer, at least one capacitor formed at least partially within an opening formed in the interposer and an integrated circuit that is operatively coupled to the interposer. A method is disclosed which includes obtaining an interposer having at least one capacitor formed at least partially within an opening in the interposer and operatively coupling an integrated circuit to the interposer. A method is also disclosed which includes obtaining an interposer comprising a dielectric material, forming an opening in the interposer and forming a capacitor that is positioned at least partially within the opening.
1. A device, comprising:
an interposer;
an integrated circuit operatively coupled to the interposer; and
at least one capacitor at least partially within an opening that extends through a thickness of the interposer;
the capacitor having:
a first insulator;
a first conductive structure extending around the first insulator;
a second insulator extending around the first conductive structure; and
a second conductive structure extending around the second insulator.
2. The device of claim 1 with the first and second insulators comprising the same material.
3. The device of claim 1 with the first insulator comprising a solid center core, and with the first and second conductive structures co-axial with the solid center core.
4. The device of claim 1 with the first conductive structure extending substantially entirely through the thickness of the interposer.
5. The device of claim 1 with the second insulator surrounding the second conductive structure on all sides.
6. The device of claim 1 with the first conductive structure surrounding the first insulator on all sides.
7. The device of claim 1 with the first conductive structure having a lower end and an upper end and with the first insulator comprising a column of solid insulator material extending entirely through the first conductive structure and covering the lower and upper ends of the first conductive structure.
8. The device of claim 1 with the first insulator comprising a solid insulating material.
9. A device comprising:
an interposer including a dielectric material body having a first side and a second side, and with metal layers on the first and second sides of the body;
an opening extending through the body and the metal layers;
a first metal ring in the opening;
an insulator ring within the first metal ring;
a second metal ring within the insulator ring;
with the first and second metal rings, and the insulator ring, having an annular cross section shape; and
an insulator cylinder within the second metal ring.
10. The device of claim 9 with cylindrical sidewalls of the body forming the hole through the body, and with the first metal ring attached to the cylindrical sidewalls.
11. The device of claim 10 with the first metal ring plated onto the cylindrical sidewalls.
12. The device of claim 9 with the first and second metal rings and the insulator ring concentric with each about a common longitudinal axis.
13. The device of claim 12 with the longitudinal axis substantially perpendicular to a mounting surface on a first side of the body.
14. The device of claim 9 with the second metal ring having a height greater than the first metal ring.
15. The device of claim 9 wherein the device comprises a plurality of capacitors and wherein the integrated circuit does not cover all of the capacitors.
16. A device, comprising:
an integrated circuit;
an interposer connected to the integrated circuit and comprising a body of first dielectric material, a first metal layer on a first side, and a second metal layer on a second side, of the body of dielectric material;
a plurality of capacitors in the interposer, with substantially each capacitor comprising:
a hole extending through the body of first dielectric material and through the first and second metal layers;
an outer metal cylindrical shell in the hole and electrically coupled to the first and second metal layers;
a dielectric cylindrical shell in the hole with the outer metal cylindrical shell surrounding the dielectric cylindrical shell;
an inner metal cylindrical shell in the hole, with the dielectric cylindrical shell surrounding the inner metal cylindrical shell;
a dielectric cylinder within the inner metal cylindrical shell; and
at least one conductive trace on the interposer electrically coupled to the inner metal cylindrical shell.
17. The device of claim 16 comprising a first conductive trace on the first side of the interposer electrically coupled to a first end of the inner metal cylindrical shell and a second conductive trace on the second side of the interposer electrically coupled to a second end of the inner metal cylindrical shell.
18. The device of claim 16 wherein the first and second metal layers are the only metal layers in the interposer.
19. The device of claim 16 wherein dielectric cylindrical shell and the dielectric cylinder comprise the same material.