Method of manufacturing nitride-based semiconductor light emitting device
View Patent ↗Provided is a method of manufacturing a nitride-based semiconductor light-emitting device having an improved structure in which optical extraction efficiency is improved. The method of manufacturing a nitride-based semiconductor light-emitting device including an n-doped semiconductor layer, an active layer, a p-doped semiconductor layer, an n-electrode and a p-electrode includes: forming an azobenzene-functionalized polymer film on a base layer by selecting one layer from the group consisting of the n-doped semiconductor layer, the p-doped semiconductor layer, the n-electrode and the p-electrode as the base layer; forming surface relief gratings of a micro-pattern caused by a photophysical mass transport property of azobenzene-functionalized polymer by irradiating interference laser beams onto the azobenzene-functionalized polymer film; forming a photonic crystal layer using a metal oxide on a recessed gap of the azobenzene-functionalized polymer film, and removing the azobenzene-functionalized polymer film.
1. A method of manufacturing a nitride-based semiconductor light-emitting device including an n-doped semiconductor layer, an active layer, a p-doped semiconductor layer, an n-electrode and a p-electrode, the method comprising:
forming an azobenzene-functionalized polymer film on a base layer by selecting one layer from the group consisting of the n-doped semiconductor layer, the p-doped semiconductor layer, the n-electrode and the p-electrode as the base layer;
forming surface relief gratings of a micro-pattern caused by a photophysical mass transport property of azobenzene-functionalized polymer by irradiating interference laser beams onto the azobenzene-functionalized polymer film;
forming a photonic crystal layer using a metal oxide on an recessed gap of the azobenzene-functionalized polymer film; and
removing the azobenzene-functionalized polymer film.
2. The method of claim 1 , further comprising etching the base layer using the photonic crystal layer as an etch mask.
3. The method of claim 1 , wherein the metal oxide comprises an oxide of a metal, the metal selected from the group consisting of titanium, zinc, niobium, tin, nickel, tungsten, and a combination comprising at least one of the foregoing metals.
4. The method of claim 3 , wherein the photonic crystal layer is formed by a sol-gel process using a metal oxide precursor.
5. The method of claim 4 , wherein the metal oxide precursor comprises one functional group selected from the group consisting of alkoxide, nitrate, chloride, acetate, and a combination comprising at least one of the foregoing functional groups.
6. The method of claim 1 , wherein the removing of the azobenzene-functionalized polymer film is performed by a heat treatment process carried out from room temperature to 425° C.
7. The method of claim 6 , wherein the heat treatment is performed for 1 to 12 hours.
8. The method of claim 1 , wherein the azobenzene-functionalized polymer has a weight averaged molecular weight of 1,000 to 500,000.
9. The method of claim 1 , wherein the azobenzene-functionalized polymer comprises polydisperse orange 3 (PDO3).
10. The method of claim 1 , wherein a 488 nm Ar laser is used as the source of the interference laser beams.
11. The method of claim 1 , wherein the micro-pattern is formed in a pattern having a pattern dimension of 2 μm or less.
12. The method of claim 11 , wherein a period of the micro-pattern is less than or equal to 10 μm.
13. The method of claim 12 , wherein the micro-pattern is formed in a pattern having a pattern dimension of equal to or less than 1 μm.
14. The method of claim 1 , wherein the micro-pattern is formed in a one dimensional (1-D) pattern, a two dimensional (2-D) pattern or a three dimensional (3-D) pattern.
15. The method of claim 1 , wherein the n-electrode is formed of a transparent conductive oxide.
16. The method of claim 1 , wherein the p-electrode is formed of a transparent conductive oxide.
17. A nitride-based semiconductor light-emitting device manufactured by the method of claim 1 .