CMP porous pad with component-filled pores

1. A method for producing a chemical-mechanical polishing pad comprising:

(i) providing a polymeric material comprising gas-filled pores,

(ii) subjecting the polymeric material to a pressure differential, wherein the pressure differential is a pressure below atmospheric pressure,

(iii) contacting at least one surface of the polymeric material with a medium comprising a component selected from a liquid, a solid, or a mixture thereof,

(iv) allowing the medium comprising the component to permeate at least a portion of the pores of the polymeric material, wherein the medium comprising the component is disposed within the pores by the pressure differential, and,

(v) forming the polymeric material comprising component-filled pores into a chemical-mechanical polishing pad.

2. The method of claim 1 , wherein the polymeric material is contacted with the medium after subjecting the porous polymeric material to a pressure differential.

3. The method of claim 1 , wherein the polymeric material is contacted with the medium prior to subjecting the porous polymeric material to a pressure differential.

4. The method of claim 1 , wherein the polymeric material comprising component-filled pores is compressed to form a polymeric sheet.

5. The method of claim 1 , wherein the component is a liquid.

6. The method of claim 1 , wherein the liquid is a solution comprising a solvent and a solute.

7. The method of claim 1 , wherein the component is a solid.

8. The method of claim 7 , wherein the solid consists essentially of particles having a largest diameter of about 1 μm or less.

9. The method of claim 7 , wherein the solid is conductive.

10. The method of claim 7 , wherein the solid consists essentially of abrasive particles.

11. The method of claim 10 , wherein the abrasive particles comprise metal oxide selected from the group consisting of alumina, silica, titania, ceria, zirconia, germania, magnesia, co-formed products thereof, and combinations thereof.