Heat sink mounted on a vehicle-transmission case
A system for dissipating heat from a semiconductor board includes a first substrate including an opening formed therein, a second substrate attached to a surface of the first substrate, and a microchip positioned in the opening and bumped to the second substrate. The system further includes a heat sink directly adhered to the microchip. A method of manufacturing a heat dissipating semiconductor board includes forming an opening in a first substrate and positioning a microchip in the opening. The method further includes directly adhering the microchip to a heat sink, bonding the microchip to a second substrate and boding a surface of the first substrate to the second substrate.
1. A system for dissipating heat from a semiconductor board, comprising:
a first substrate including an opening formed therein;
a second substrate attached to a surface of the first substrate;
a microchip positioned in the opening and bumped to the second substrate;
a heat sink directly adhered to the microchip;
a transmission case, and the heat sink is integral with the transmission case; and
at least one ridge formed as part of the heat sink, the at least one ridge sized to fit within the opening.
2. The system of claim 1 wherein the first substrate is FR-4 board.
3. The system of claim 1 wherein the first substrate is a low density ceramic board.
4. The system of claim 1 wherein the second substrate is a HDI board.
5. The system of claim 1 wherein the second substrate is a Low Temperature Co-fired Ceramic board.
6. The system of claim 1 wherein the second substrate is a ceramic board.
7. The system of claim 1 wherein the heat sink adheres to the microchip with a high thermal conductivity adhesive, wherein the high thermal conductivity adhesive has a conductivity greater than 2.5 W/m-K.
8. The system of claim 1 further comprising at least one chip bumped to the second substrate, wherein the at least one chip is bumped to the second substrate on a first side of the second substrate, and wherein the microchip is bumped to the second substrate on a second side of the second substrate, and wherein the first side of the second substrate opposes the second side of the second substrate.
9. The system of claim 1 wherein the heat sink adheres to the first substrate with a low thermal conductivity adhesive, wherein the low conductivity adhesive has a conductivity less than 0.9 W/m-K.
10. The system of claim 1 wherein the bumps are gold bumps.
11. The system of claim 1 wherein the bumps are solder bumps.
12. The system of claim 1 wherein the microchip includes instructions for operating a transmission.
13. The system of claim 1 wherein the microchip includes instructions for operating an engine.
14. A method of manufacturing a heat dissipating semiconductor board, the method comprising:
forming an opening in a first substrate;
bonding a microchip to a second substrate;
positioning the microchip in the opening;
directly adhering the microchip to a heat sink;
bonding a surface of the first substrate to the second substrate;
mounting the heat sink on a transmission case, the heat sink having at least one ridge sized to fit within the opening.
15. The method of claim 14 further comprising:
bumping at least one chip to the second substrate, wherein the at least one chip is bumped to the second substrate on a first side of the second substrate, and wherein the microchip is bumped to the second substrate on a second side of the second substrate, and wherein the first side of the second substrate opposes the second side of the second substrate.
16. A system for dissipating heat from a semiconductor board, comprising:
a first substrate including an opening formed therein;
a second substrate attached to an upper surface of the first substrate;
a microchip positioned in the opening and bumped to the second substrate;
means for adhering a heat sink directly to the microchip; and
means for mounting the heat sink on a transmission case, such that at least one ridge formed as part of the heat sink is sized to fit within the opening.