IP Library Granted Patent US 8,285,522
Granted Patent B1
US 8,285,522 · App. 11/698,262 · Granted Oct 9, 2012

Materials-based failure analysis in design of electronic devices

Assignee: Vextec Corporation
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Quick Facts
Patent No.
US 8,285,522
App. No.
11/698,262
Granted
Oct 9, 2012
Kind
B1
Abstract

The technology includes methods, a system, and a computer readable medium for predicting the failure of an electronic device during design of the device, by receiving data associated with the device, the data including data indicative of a device response to a specific load on the system while the device is in operation, and predicting potential failure of the device using a probabilistic model and the data, wherein the probabilistic model utilizes at least one of fast probability methods and simulation techniques.

Claims (59)

1. A computer-implemented method for using a prediction of failure of an electronic device during design of the device, the method comprising:

receiving data associated with a metallic component in the device, the data including data indicative of a response of the component to a specific load on the component while the device is in operation; and

calculating a prediction indicative of a potential failure of the device using a probabilistic model of failure of the component, wherein the probabilistic model is based on at least the specific load, and a microstructure-based failure model and the data, and wherein the probabilistic model utilizes at least one of fast probability methods and simulation techniques, and wherein the microstructure-based failure model represents heterogeneous microstructures in the component, and includes one or more of a crack nucleation model and a short crack growth model.

2. The method of claim 1 wherein the probabilistic model is derived by a method comprising:

obtaining a Finite Element Model (FEM) of the component;

analyzing the FEM to obtain stresses at nodes of the FEM;

determining a Representative Volume Element (RVE) for at least one of the nodes;

building a microstructure-based failure model for at least one RVE and including the microstructure-based failure model in the RVE;

simulating a component life using at least one RVE microstructure-based failure model, the simulating producing a result related to the component life; and

performing the simulating a plurality of times to produce results related to component life, wherein the results are used to provide a prediction of failure for the component.

3. The method of claim 1 , wherein the probabilistic model utilizes a fast probability method selected from: a first order reliability method; a second order reliability method; an advanced mean value method, and a mean value method.

4. The method of claim 1 , wherein the probabilistic model utilizes a simulation technique selected from: a Monte Carlo method, an importance sampling method, a Latin Hypercube method, and a stratified sampling method.

5. The method of claim 2 , wherein the microstructure-based failure model further includes a long crack growth model.

6. The method of claim 2 , wherein one of the results related to the component life, is a minimum number of cycles or a time to failure for any RVE.

7. The method of claim 2 , wherein the simulating comprises:

establishing a density of potential nucleation sites within each RVE;

establishing a number of potential nucleation sites within each RVE;

determining the number of cycles to failure for each potential nucleation site; and

calculating the life of the RVE as the smallest number of cycles to failure for any of the potential nucleation sites.

8. A computer system, configured to use a prediction of failure of an electronic device during design of the device, the system comprising:

a processor; and

a memory, wherein the processor is configured to execute instructions for:

receiving data associated with a metallic component in the device, the data including data indicative of a response of the component to a specific load on the component while the device is in operation; and

calculating a prediction indicative of a potential failure of the device using a probabilistic model of failure of the component, wherein the probabilistic model is based on at least the specific load, and a microstructure-based failure model and the data, and wherein the probabilistic model utilizes at least one of fast probability methods and simulation techniques, and wherein the microstructure-based failure model represents heterogeneous microstructures in the component, and includes one or more of a crack nucleation model and a short crack growth model.

9. The system of claim 8 wherein the processor is further configured to execute instructions for deriving the probabilistic model, according to:

obtaining a Finite Element Model (FEM) of the component;

analyzing the FEM to obtain stresses at nodes of the FEM;

determining a Representative Volume Element (RVE) for at least one of the nodes;

building a microstructure-based failure model for at least one RVE and including the microstructure-based failure model in the RVE;

simulating a component life using at least one RVE microstructure-based failure model, the simulating producing a result related to the component life; and

performing the simulating a plurality of times to produce results related to component life, wherein the results are used to provide a prediction of failure for the component.

10. The system of claim 8 , wherein the probabilistic model utilizes a fast probability method selected from: a first order reliability method; a second order reliability method; an advanced mean value method, and a mean value method.

11. The system of claim 8 , wherein the probabilistic model utilizes a simulation technique selected from: a Monte Carlo method, an importance sampling method, a Latin Hypercube method, and a stratified sampling method.

12. The system of claim 9 , wherein the microstructure-based failure model further includes a long crack growth model.

13. The system of claim 9 , wherein one of the results related to the component life, is a minimum number of cycles or a time to failure for any RVE.

14. The system of claim 9 , wherein the simulating comprises:

establishing a density of potential nucleation sites within each RVE;

establishing a number of potential nucleation sites within each RVE;

determining the number of cycles to failure for each potential nucleation site; and

calculating the life of the RVE as the smallest number of cycles to failure for any of the potential nucleation sites.

15. A computer readable non-transitory medium, configured with instructions for using a prediction of failure of an electronic device during design of the device, the instructions comprising instructions for:

receiving data associated with a metallic component in the device, the data including data indicative of a response of the component to a specific load on the component while the device is in operation; and

calculating a prediction indicative of a potential failure of the device using a probabilistic model of failure of the component, wherein the probabilistic model is based on at least the specific load, and a microstructure-based failure model and the data, and wherein the probabilistic model utilizes at least one of fast probability methods and simulation techniques, and wherein the microstructure-based failure model represents heterogeneous microstructures in the component, and includes one or more of a crack nucleation model and a short crack growth model.

16. The medium of claim 15 , configured with further instructions for deriving the probabilistic model, the instructions comprising instructions for:

obtaining a Finite Element Model (FEM) of the component;

analyzing the FEM to obtain stresses at nodes of the FEM;

determining a Representative Volume Element (RVE) for at least one of the nodes;

building a microstructure-based failure model for at least one RVE and including the microstructure-based failure model in the RVE;

simulating a component life using at least one RVE microstructure-based failure model, the simulating producing a result related to the component life; and

performing the simulating a plurality of times to produce results related to component life, wherein the results are used to provide a prediction of failure for the component.

17. The medium of claim 15 , wherein the probabilistic model utilizes a fast probability method selected from: a first order reliability method; a second order reliability method; an advanced mean value method, and a mean value method.

18. The medium of claim 15 , wherein the probabilistic model utilizes a simulation technique selected from: a Monte Carlo method, an importance sampling method, a Latin Hypercube method, and a stratified sampling method.

19. The medium of claim 16 , wherein the microstructure-based failure model further includes a long crack growth model.

20. The medium of claim 16 , wherein one of the results related to the component life, is a minimum number of cycles or a time to failure for any RVE.

21. The medium of claim 16 , wherein the simulating comprises:

establishing a density of potential nucleation sites within each RVE;

establishing a number of potential nucleation sites within each RVE;

determining the number of cycles to failure for each potential nucleation site; and

calculating the life of the RVE as the smallest number of cycles to failure for any of the potential nucleation sites.

Assignments (2)
CONFIRMATORY LICENSE Recorded Sep 28, 2016
From: VEXTEC CORPORATION
To: NAVY, DEPARTMENT OF THE
Reel/Frame 040180/0942 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 18, 2007
From: TRYON, ROBERT G.; DEY, ANIMESH; NASSER, LOREN A.; KRISHNAN, GANAPATHI
To: VEXTEC CORPORATION
Reel/Frame 019844/0302 →
Continuity (2)
Provisional Application 60761958 · Jan 24, 2006
Provisional Application 60778196 · Mar 1, 2006