Wafer surface observing method and apparatus
View Patent ↗A wafer surface observing apparatus for inspecting a peripheral portion of an object has (A) a lens system and a CCD camera for taking images of the peripheral portion of the object, (B) storage for storing image data about the taken images, and (C) display for displaying the image data stored in the storage device. In particular, the present apparatus can have functions of rotating the object placed on a prealignment portion, recording images of one full outer periphery of an end portion of the object by the lens system and CCD camera into the location where the orientation flat portions or notched portions of the object are placed in position, accepting the images into the storage device, and displaying the images on a CRT.
1. An inspection system comprising:
a pre-alignment unit which aligns a position of an object to be inspected;
an edge observing unit which is arranged in the pre-alignment unit and acquires an image of an edge of the object;
a surface inspection unit which detects a defect located inside and away from the edge of the object; and
a processing unit which relates the image obtained with the edge observing unit to a defect map obtained with the surface inspection unit.
2. The inspection system according to claim 1 , wherein the processing unit relates the image to a lot number of the object.
3. The inspection system according to claim 1 , wherein the processing unit relates the image to a slot number of the object.
4. The inspection system according to claim 1 , wherein the processing unit comprises an interface which controls timing for acquiring the image.
5. The inspection system according to claim 1 , further comprising:
a display unit which displays a plurality of images of the edge in a lot.
6. The inspection system according to claim 1 , further comprising:
a display unit which displays a plurality of images of the edge in process steps.
7. The inspection system according to claim 1 , wherein the edge observing unit comprises:
an illumination unit which illuminates the edge;
a magnification unit which detects light from the edge; and
an imaging sensor which detects light passed through the magnification unit.
8. The inspection system according to claim 7 , wherein the illumination unit comprises a ring illumination unit.
9. The inspection system according to claim 8 , further comprising:
a reflection plate which reflects the light from the edge.
10. The inspection system according to claim 7 , wherein the illumination unit comprises:
a light source;
a fiber which leads light from the light source; and
a cylindrical lens which focuses light passed through the fiber.
11. The inspection system according to claim 1 , wherein:
the edge observing unit acquires a plurality of images at different areas of the edge, and
the processing unit relates the defect map to the images.
12. The inspection system according to claim 1 , wherein the surface inspection unit detects a defect pattern formed on the object.