Inspection system and inspection method

1. An inspection system for inspecting a heightwise variation in a sample, comprising:

holding means for holding a first sample;

charging means for charging the first sample held by the holding means voltage application means for applying a voltage to the first sample held by the holding means;

an electro-optic system that radiates an electron beam to the first sample applied with the voltage by the voltage application means and images a mirror electron returning near a surface of first the sample; and

an image processing means for processing a first mirror image acquired by imaging the mirror electron,

wherein the image processing means outputs information corresponding to a difference between the first mirror image acquired by the mirror electron and a second mirror image of a second sample used as a standard for determining a heightwise variation of the first sample,

wherein the image processing means performs a first process for Fourier-transforming the first mirror image acquired by imaging the mirror electron to generate a first Fourier transform image;

wherein the image processing means performs a second process for synthesizing the first Fourier transform image with a filter pattern for removing information about an elevation difference from a second Fourier transform image for the second mirror image to generate a composite image; and

wherein the image processing means performs a third process for performing an inverse Fourier transform on the composite image to generate an inverse Fourier transform image and outputting the inverse Fourier transform image as the information corresponding to the difference.

2. The inspection system according to claim 1 , wherein the image processing means further performs a fourth process for analyzing a spectrum of the inverse Fourier transform image to output a histogram.

3. The inspection system according to claim 1 , wherein the image processing means performs a fourth process for generating a difference image representing the difference between the first mirror image the second mirror image; and

wherein the image processing means performs a fifth process for digitizing pixels constituting the difference image to generate a digitized image and outputting the digitized image as the information corresponding to the difference.

4. The inspection system according to claim 3 , wherein the image processing means further performs a sixth process for calculating and outputting a ratio of white and black pixels constituting the digitized image.

5. The inspection system according to claim 1 , further comprising:

storage means for storing an optical condition for the electro-optic system in association with information about a sample height;

measurement means for measuring the sample height at a resolution lower than a region of the first sample having a heightwise variation identifiable from the information corresponding to the difference; and

setup means for setting the optical condition stored in the storage means in association with the sample height measured by the measurement means for the electro-optic system.

6. The inspection system according to claim 5 , further comprising a third sample used as a standard for height correction including a test piece having different heights;

wherein the holding means further holds the third sample used as a standard for height correction; and

wherein the storage means stores optical information in association with each height of the test piece when the electro-optic system captures a respective mirror image of each height of the test piece for the third sample used as a standard for height correction held by the holding means.

7. The inspection system according to claim 1 , further comprising:

AFM-specific holding means for holding the first sample; and

an AFM (Atomic Force Microscopy) for measuring a heightwise shape of the first sample held by the AFM-specific holding means.

8. The inspection method according to claim 1 , wherein the first sample is a semiconductor wafer in a semiconductor device manufacturing process.

9. A program readable on a computer for inspecting a heightwise variation in a sample, wherein the program allows a computer to function as:

means for acquiring a mirror image resulting from radiating an electron beam to a sample applied with a voltage and imaging a mirror electron returning near a surface of the sample; and

means for generating information corresponding to a difference between a mirror image acquired by imaging the mirror electron and a mirror image for a prepared standard preparation and outputting the information as a heightwise variation in the sample.