Bare chip embedded PCB
A PCB having an embedded bare chip includes an insulated substrate having a penetration hole formed therein; a filler filling up an inside of the penetration hole; a bare chip embedded in the filler such that electrode pads formed on one side thereof are exposed at the surface of the filler; and an electrode bump attached to a surface of the electrode pads and protruded to be exposed to the outside.
1. A printed circuit board (PCB) having an embedded bare chip, the PCB comprising:
an insulated substrate having a penetration hole formed therein;
a filler filling up an inside of the penetration hole;
a bare chip embedded in the filler such that electrode pads formed on one side thereof are exposed at the surface of the filler, the electrode pads having approximately a same height as an upper surface of the bare chip or being slightly caved in relative to the upper surface of the bare chip;
an electrode bump, a surface of the electrode bump being attached to a surface of one of the electrode pads, the electrode bump protruding so that surfaces of the electrode bump, other than the surface attached to the surface of one of the electrode pads, are exposed to the outside; and
a circuit pattern formed on the insulated substrate,
wherein the electrode bump is formed simultaneously with the circuit pattern in a plating process of forming the circuit pattern, and
the circuit pattern is formed directly on the insulating substrate.
2. The PCB of claim 1 , wherein the electrode bump comprises a diffusion stopping layer positioned at a surface of the electrode pad, and a thick film laminated on a surface of the diffusion stopping layer.
3. The PCB of claim 2 , wherein the diffusion stopping layer comprises titanium.
4. The PCB of claim 1 , wherein the surface of the electrode bump attached to the surface of one of the electrode pads is at approximately the same height as a surface of the circuit pattern attached to a surface of the insulated substrate.