Light emitting diode package
View Patent ↗A light emitting diode package with reduced light loss includes a package substrate, a light emitting diode chip mounted on the package substrate and an encapsulant formed on the package substrate to encapsulate the light emitting diode chip. The encapsulant has a refractive index gradient with refractive indices continuously increasing from a peripheral surface thereof to a central axis thereof.
1. A light emitting diode package comprising:
a package substrate;
a light emitting diode chip mounted on the package substrate;
an encapsulant formed on the package substrate to encapsulate the light emitting diode chip,
wherein the encapsulant has a refractive index gradient with refractive indices continuously increasing from a peripheral surface thereof to a central axis thereof.
2. The light emitting diode package according to claim 1 , wherein the refractive indices of the encapsulant increase nonlinearly from the peripheral surface thereof to the central axis thereof.
3. The light emitting diode package according to claim 2 , wherein the refractive index gradient of the encapsulant has a parabolic form with respect to a horizontal distance.
4. The light emitting diode package according to claim 2 , wherein the refractive index gradient of the encapsulant has a semicircular form with respect to a horizontal distance.
5. The light emitting diode package according to claim 1 , wherein the refractive indices of the encapsulant increase linearly from the peripheral surface thereof to the central axis thereof.
6. The light emitting diode package according to claim 1 , wherein the encapsulant comprises a polymer resin.
7. The light emitting diode package according to claim 1 , wherein the encapsulant comprises glass.
8. The light emitting diode package according to claim 1 , wherein the refractive index of the encapsulant is higher in an upper region thereof than in a lower region thereof.
9. The light emitting diode package according to claim 8 , wherein the refractive indices of the encapsulant increase continuously from a lower region thereof to an upper region thereof.
10. The light emitting diode package according to claim 1 , further comprising a reflecting cup disposed on the package substrate, wherein the light emitting diode chip is mounted on a floor surface of the reflecting cup.
11. The light emitting diode package according to claim 10 , wherein the reflecting cup has a reflective metal film coated on an inner surface thereof.
12. The light emitting didoe package according to claim 10 , wherein the reflecting cup has oxide powder having a refractive index of at least 2.0 dispersed therein.
13. The light emitting diode package according to claim 12 , wherein the oxide powder comprises TiO 2 .