Method of manufacturing light emitting diode package
View Patent ↗A method of manufacturing a light emitting diode package. A cup-shaped package structure with a recess formed therein and an electrode structure formed on a bottom of the recess is prepared. A light emitting diode chip is mounted on a bottom of the recess with a terminal of the chip electrically connected to the electrode structure. A liquid-state transparent resin is injected in the recess and before the liquid-state transparent resin is completely cured, a stamp with a micro rough pattern engraved thereon is applied on an upper surface of the resin. The liquid-state transparent resin is cured with the stamp applied thereon to form a resin encapsulant and the stamp is removed from the resin encapsulant.
1. A method of manufacturing a light emitting diode package comprising:
preparing a cup-shaped package structure with a recess formed in an upper surface thereof and an electrode structure formed on a bottom of the recess;
mounting a light emitting diode chip on a bottom of the recess with a terminal of the light emitting diode chip electrically connected to the electrode structure;
injecting a liquid-state transparent resin into the recess of the package structure;
curing the injected liquid-state transparent resin until the injected liquid-state transparent resin is in a partially cured state;
applying a stamp with a micro rough pattern engraved thereon to an upper surface of the partially cured liquid-state transparent resin before the liquid-state transparent resin is completely cured;
curing the partially cured liquid-state transparent resin with the stamp applied thereto completely to form a resin encapsulant; and
removing the stamp from the resin encapsulant.
2. The method according to claim 1 , wherein the step of injecting a liquid-state transparent resin comprises injecting the liquid-state transparent resin in such an amount that the upper surface of the injected liquid-state transparent resin is higher than the upper end of the recess of the package structure.
3. The method according to claim 2 , wherein the entire upper surface of the injected liquid-state transparent resin is higher than the upper end of the recess of the package structure.
4. The method according to claim 1 , wherein the liquid-state transparent resin has phosphor dispersed therein to convert the wavelength of emitted light.
5. The method according to claim 1 , further comprising forming a phosphor film for converting the wavelength of emitted light on a surface of the light emitting diode chip before forming a resin encapsulant.
6. The method according to claim 1 , wherein the step of forming a resin encapsulant comprises a deaeration process to remove bubbles in the liquid-state transparent resin with the stamp applied to the liquid-state transparent resin.
7. The method according to claim 1 , wherein the stamp comprises a planar structure with the micro rough pattern engraved on a surface thereof.
8. The method according to claim 1 , wherein the micro rough pattern engraved on the stamp comprises a plurality of triangular prisms arranged in one direction.
9. The method according to claim 1 , wherein the rough pattern engraved on the stamp comprises a plurality of quadrangular pyramids arranged in lines and rows.
10. The method according to claim 1 , further comprising applying a release agent on a surface of the stamp that comes in contact with the transparent resin before applying the stamp.