Methods and apparatus to improve frit-sealed glass package

1. A hermetically sealed package, comprising:

a first plate including inside and outside surfaces;

one or more electronic components, including anode and cathode electrodes, disposed on the inside surface of the first plate;

a second plate including inside and outside surfaces;

frit material disposed on the inside surface of the second plate; and

at least one dielectric layer disposed directly or indirectly on at least one of: (i) the inside surface of the first plate at least opposite to the frit material, and (ii) the inside surface of the second plate at least directly or indirectly on the frit material, with the at least one dielectric layer at least partially covering at least one of the anode and cathode electrodes;

wherein the frit material forms a hermetic seal against the dielectric layer in response to heating.

2. The package of claim 1 , wherein at least one of the first and second plates are formed from a material selected from the group consisting of metals, alloys, ceramics, glasses, quartz, and polymers.

3. The package of claim 1 , wherein the dielectric layer includes silicon nitride.

4. The package of claim 3 , wherein the dielectric layer has a thickness of one of: between about 10 to 600 nm; between about 100 to 500 nm; between about 200-500 nm, between about 10 to 50 nm, and about 400 nm.

5. The package of claim 3 , wherein the dielectric layer includes a layer of silicon oxide over the silicon nitride.

6. The package of claim 5 , wherein:

the layer of silicon oxide has a thickness of about 10-100 nm; and

the layer of silicon nitride has a thickness of one of: between about 10 to 500 nm; between about 100 to 500 nm; between about 200-500 nm, between about 10 to 50 nm, and about 400 nm.

7. The package of claim 1 , wherein the dielectric layer exhibits a compressive stress of one of: about 0.01-700 MPa, about 200-500 MPa, about 400-500 MPa, and about 500 MPa.

8. The package of claim 1 , wherein one of:

the at least one dielectric layer does not cover the one or more electronic components; and

the at least one dielectric layer covers the one or more electronic components, thereby reducing corrosion thereof.

9. The package of claim 1 , wherein the one or more electronic components includes one or more organic light emitting devices (OLEDs).

10. The package of claim 1 , wherein at least one of:

the dielectric layer covers the frit material and directly covers at least a portion of the inside surface of the second plate;

the dielectric layer covers the frit material and directly covers substantially all of the inside surface of the second plate;

the dielectric layer covers the frit material and does not covers substantial portions of the inside surface of the second plate.

11. The package of claim 1 , wherein one of:

the at least one dielectric layer is disposed directly or indirectly on the inside surfaces of both the first and second plates; and

the at least one dielectric layer is disposed directly or indirectly on the inside surface of one of the first and second plates.

12. A hermetically sealed package, comprising:

a first plate including inside and outside surfaces;

one or more electronic components disposed on the inside surface of the first plate;

a second plate including inside and outside surfaces;

frit material disposed on the inside surface of the second plate;

at least one dielectric layer disposed directly or indirectly on at least one of: (i) the inside surface of the first plate at least opposite to the frit material, and (ii) the inside surface of the second plate at least directly or indirectly on the frit material, wherein the dielectric layer is formed of a layer of silicon nitride and a layer of silicon oxide on the layer of silicon nitride, with the silicon nitride layer gradually transitioning into the silicon oxide layer at the interface between the silicon nitride layer and the silicon oxide layer; and

wherein the frit material forms a hermetic seal against the dielectric layer.

13. The package of claim 12 , wherein one of:

the at least one dielectric layer does not cover the one or more electronic components; and

the at least one dielectric layer covers the one or more electronic components, thereby reducing corrosion thereof.

14. The package of claim 12 , wherein the one or more electronic components includes one or more organic light emitting devices (OLEDs).

15. The package of claim 14 , wherein:

the one or more OLEDs include anode and cathode electrodes; and

the at least one dielectric layer at least partially covers at least one of the anode and cathode electrodes.

16. The package of claim 12 , wherein at least one of:

the dielectric layer covers the frit material and directly covers at least a portion of the inside surface of the second plate;

the dielectric layer covers the frit material and directly covers substantially all of the inside surface of the second plate; the dielectric layer covers the frit material and does not cover substantial portions of the inside surface of the second plate.

17. The package of claim 12 , wherein at least one of the first and second plates are formed of glass.

18. An organic light emitting device (OLED), comprising:

first and second glass plates, each including respective inside and outside surfaces;

one or more OLEDs, including anode and cathode electrodes, disposed on the inside surface of the first glass plate;

frit material disposed on the inside surface of the second glass plate; and

at least one dielectric layer disposed directly or indirectly on at least one of: (i) the inside surface of the first glass plate at least opposite to the frit material, and (ii) the inside surface of the second glass plate at least directly or indirectly on the frit material, with the dielectric layer at least partially covering at least one of the anode and cathode electrodes;

wherein the frit material forms a hermetic seal against the dielectric layer.

19. The package of claim 18 , wherein at least one of the first and second plates are formed of glass.