Backlight unit equipped with light emitting diodes

1. A backlight unit equipped with Light-Emitting Diodes (LEDs), comprising:

an insulating substrate provided with predetermined circuit patterns on one surface thereof;

a plurality of LED packages mounted above the insulating substrate and electrically connected to the circuit patterns;

an upper heat dissipation plate formed on the insulating substrate, and configured to come into contact with the circuit patterns and to dissipate heat generated in the LED packages;

a lower heat dissipation plate formed on a remaining surface of the insulating substrate, and configured to transmit heat transmitted through the upper heat dissipation plate; and

a chassis disposed in the remaining surface of the insulating substrate and fixedly combined with the insulating substrate,

wherein the upper heat dissipation plate and the lower heat dissipation plate are connected to each other by at least one through hole that passes through the insulating substrate and is plated with plating material on an inner wall thereof, and the through hole and the upper heat dissipation plate have a predetermined area ratio,

the insulating substrate is provided with an insulating film which is configured to cover the lower heat dissipation plate,

wherein the insulating substrate and the chassis are combined with each other using a fastener penetrating at least a corner of the insulating substrate and the chassis.

2. The backlight unit as set forth in claim 1 , wherein the upper heat dissipation plate and the lower heat dissipation plate are made of copper and each have a thickness of about 0.35 μm.

3. The backlight unit as set forth in claim 1 , wherein the insulating film is applied through sputtering or spraying.

4. The backlight unit as set forth in claim 3 , wherein the insulating film has a thickness of about 0.35 μm.

5. The backlight unit as set forth in claim 4 , wherein the through holes are plated with copper on the inner walls thereof, but are not filled with filling material so as to reduce the weight of the backlight unit.

6. The backlight unit as set forth in claim 1 , wherein the area ratio of the through hole and the upper heat dissipation plate ranges from 1:10 to 1:300.

7. The backlight unit as set forth in claim 1 , wherein the insulating substrate is provided with the circuit patterns on an epoxy resin.

8. The backlight unit as set forth in claim 1 , wherein the LED packages comprising:

two LED electrodes connected to the circuit patterns;

an LED chip mounted on one of the LED electrodes;

a plastic mold casing protecting the LED electrode and the LED chip from the outside; and

a lens covering the plastic mold casing.

9. The backlight unit as set forth in claim 1 , wherein the chassis is made of metallic material having thermal conductivity.

10. The backlight unit as set forth in claim 1 , wherein the fastener is a bolt.

11. A backlight unit equipped with Light-Emitting Diodes (LEDs), comprising:

an insulating substrate provided with predetermined circuit patterns on the top surface thereof;

a plurality of LED packages mounted above the insulating substrate and electrically connected to the circuit patterns;

an upper heat dissipation plate formed on the top surface of insulating substrate, and configured to come into contact with the circuit patterns and to dissipate heat generated in the LED packages; and

a lower heat dissipation plate formed on the bottom surface of the insulating substrate, and configured to transmit heat transmitted through the upper heat dissipation plate, wherein the upper heat dissipation plate and the lower heat dissipation plate are connected to each other by at least one through hole that passes through the insulating substrate and is plated with plating material on an inner wall thereof,

an insulating film formed under the lower heat dissipation plate; and

a chassis disposed under the insulating film to be fixedly combined with the insulating substrate and the insulating film,

wherein the insulating substrate and the chassis are combined with each other using a fastener penetrating at least a corner of the insulating substrate and the chassis.

12. The backlight unit as set forth in claim 1 , wherein the insulating substrate, the insulating film and the chassis are combined with each other using a fastener penetrating at least a portion of the insulating substrate, the insulating film and the chassis.

13. A backlight unit equipped with Light-Emitting Diodes (LEDs), comprising:

an insulating substrate provided with predetermined circuit patterns on the top surface thereof;

a plurality of LED packages mounted above the insulating substrate and electrically connected to the circuit patterns;

an upper heat dissipation plate formed on the top surface of insulating substrate, and configured to come into contact with the circuit patterns and to dissipate heat generated in the LED packages;

a lower heat dissipation plate formed on the bottom surface of the insulating substrate, and configured to transmit heat transmitted through the upper heat dissipation plate; and

a chassis disposed under the lower heat dissipation plate to be fixedly combined with the insulating substrate,

wherein the insulating substrate and the chassis are combined with each other using a fastener penetrating a portion of the insulating substrate and the chassis where the upper heat dissipation plate and the lower heat dissipation plate are not formed.

14. The backlight unit as set forth in claim 13 , wherein the upper heat dissipation plate and the lower heat dissipation plate are connected to each other by at least one through hole that passes through the insulating substrate and is plated with plating material on an inner wall thereof.

15. The backlight unit as set forth in claim 13 , further comprising:

an insulating film formed under the lower heat dissipation plate.

16. The backlight unit as set forth in claim 13 , wherein the portion of the insulating substrate and the chassis is a corner of the insulating substrate and the chassis.