Thin multichip flex-module

1 . A thin multichip module comprising:

a frame comprising a recessed cavity;

a flexible circuit having a plurality of integrated circuit chips disposed thereon, said flexible circuit bonded to said frame over at least a portion of said cavity; and said chips enclosed within said cavity by said flexible circuit; and,

electrodes on said module configured to be accessible to an external socket after said frame is inserted in said module.

2 . The module of claim 1 wherein said flexible circuit includes an array of contacts and said flexible circuit is applied to said frame such that said array of contacts are aligned along an edge of said frame for mating with said socket.

3 . The module of claim 2 wherein said flexible circuit is applied to first and second major surfaces of said frame.

4 . The module of claim 1 wherein said frame comprises recessed cavities on the first and second major surfaces of said frame; and said flexible circuit is folded around an edge adjoining said first and second major surfaces of said frame, and said chips are enclosed within said cavities on the first and second major surfaces by said flexible circuit.

5 . The module of claim 4 wherein said frame comprises a printed circuit board with said chips bonded within recessed cavities on said first and second major surfaces of said frame.

6 . The module of claim 1 wherein said frame comprises electrical an circuit connecting at least a portion of said chips on said first surface to said chips on said second surface.

7 . The module of claim 1 further comprising an internal heat pipe.