Patent Assignment
Reel/Frame 021062/0036
Assignment of Assignor's Interest
Recorded: 2008-05-23
Pages: 7
Assignors
CLAYTON, JAMES E.
Executed: 2008-05-16
FATHI, ZAKARYAE
Executed: 2008-05-16
GENTRY, JAMES R.
Executed: 2008-05-16
Assignee
MICROELECTRONICS ASSEMBLY TECHNOLOGIES, INC.
104 T.W. ALEXANDER DR., RESEARCH TRIANGLE PARK, NORTH CAROLINA, 27711
Covered Properties
(7)
Thin Multichip Flex-Module
Thin Multichip Flex-Module
Thin multichip flex-module
Application:
11/715,142 →
Publication:
US 2007/0211711
Thin Multichip Flex-Module
Thin Multichip Flex-Module
Thin Multichip Flex-Module
Thermal management system for computers
Application:
12/069,372 →
Publication:
US 2008/0192428