IP Library Assignment 021062/0036
Patent Assignment
Reel/Frame 021062/0036

Assignment of Assignor's Interest

Recorded: 2008-05-23 Pages: 7
Assignors
CLAYTON, JAMES E.
Executed: 2008-05-16
FATHI, ZAKARYAE
Executed: 2008-05-16
GENTRY, JAMES R.
Executed: 2008-05-16
Assignee
MICROELECTRONICS ASSEMBLY TECHNOLOGIES, INC.
104 T.W. ALEXANDER DR., RESEARCH TRIANGLE PARK, NORTH CAROLINA, 27711
Covered Properties (7)
Thin Multichip Flex-Module
Patent: 7,429,788 →
Application: 11/715,091 →
Publication: US 2007/0212906
Thin Multichip Flex-Module
Patent: 7,393,226 →
Application: 11/715,141 →
Publication: US 2007/0212919
Thin multichip flex-module
Application: 11/715,142 →
Publication: US 2007/0211711
Thin Multichip Flex-Module
Patent: 7,787,254 →
Application: 11/715,205 →
Publication: US 2007/0211426
Thin Multichip Flex-Module
Patent: 7,520,781 →
Application: 11/715,206 →
Publication: US 2007/0212920
Thin Multichip Flex-Module
Patent: 7,394,149 →
Application: 11/715,303 →
Publication: US 2007/0212902
Thermal management system for computers
Application: 12/069,372 →
Publication: US 2008/0192428