Thin multichip flex-module
A socket assembly for multichip in-line modules comprises: at least three parallel in-line sockets, one of which is an edge-card socket adapted to matably engage electrodes on the edge of a printed circuit board, and the others of which are module sockets adapted to accept multichip in-line modules; and, internal connections between respective pins in each of the parallel sockets, whereby signals from the printed circuit board may be simultaneously carried to each of the multichip in-line modules. Alternatively, a socket assembly for multichip in-line modules comprises: a substantially rigid housing structure; at least two parallel in-line sockets adapted to accept multichip in-line modules; a set of electrodes adapted for soldering to a printed circuit board; and, internal connections between respective pins in each of the parallel sockets and the set of electrodes, whereby signals from the printed circuit board may be simultaneously carried to each of the multichip in-line modules.
1. A socket assembly for multichip in-line modules comprising:
at least three parallel in-line sockets, one of which is an edge-card socket adapted to matably engage electrodes on the edge of a printed circuit board, and the others of which are module sockets adapted to accept multichip in-line modules;
internal connections between respective pins in each of said parallel sockets, whereby signals from said printed circuit board may be simultaneously carried to each of said multichip in-line modules; and,
a rigid adaptor having;
a first connector strip adapted to engage one of said module sockets;
a second connector strip adapted to engage said edge-card socket, said first and second connector strips disposed substantially in parallel and spaced apart adequately to allow a second socket assembly to be engaged thereon; and,
internal connections between respective pins in each of said connector strips.