Thin multichip flex-module

1. A multichip module comprising:

a first cover plate defining one outer wall of a chamber;

a second cover plate defining the opposite wall of said chamber;

a sealable interface joining said first and second cover plates at their peripheries, whereby a hollow chamber is formed;

a flex circuit having a plurality of integrated circuit chips disposed thereon, said flex circuit affixed to at least one of said first and second cover plates;

electrical contacts at least partially extending outward through said sealable interface; and,

a fluid inlet and a fluid outlet directing fluid flow through said chamber whereby heat generated by said integrated circuit chips is removed from said module and wherein said electrical contacts and at least one of said fluid inlet and outlet is matable with a socket having both electrical and fluid connections therein.

2. The module of claim 1 wherein said integrated circuit chips are in direct contact with said fluid.

3. The module of claim 1 wherein said integrated circuit chips are in thermal contact with at least one of said cover plates and said cover plate is in direct contact with said fluid.

4. The module of claim 1 wherein said fluid comprises a liquid selected from the group consisting of: water, glycols, and fluorocarbons.

5. The module of claim 1 wherein said fluid comprises a gas selected from the group consisting of: air, nitrogen, and argon.

6. The module of claim 1 wherein both said fluid inlet and said fluid outlet are located on a common edge of said module with said outwardly extending electrical contacts, whereby said fluid inlet, said fluid outlet, and said electrical contacts are matably engagable to a single socket assembly providing both electrical and fluidic connections to said module.

7. The module of claim 1 wherein said fluid inlet is located on a common edge of said module with said outwardly extending electrical contacts, and said fluid outlet is located on another edge of said module, whereby said fluid is supplied to said module by a socket assembly that further provides electrical connections to said module, and said fluid is vented through said outlet.

8. The module of claim 1 wherein said first and said second cover plates comprise two halves of a foldable frame that are folded together and come into contact at said sealable interface, thereby forming said chamber.

9. The module of claim 1 wherein said integrated circuit chips are attached to said flex circuit using a conductive adhesive.

10. The module of claim 1 wherein said integrated circuit chips are attached to said flex circuit by soldering.