Substrate processing pallet with cooling
View Patent ↗A substrate processing pallet can cool a substrate. A substrate processing pallet can include a base member; an interface pad attachable to the base member, the interface pad having substantially the same coefficient of thermal expansion as the base member and adapted to facilitate cooling of the substrate; and a surface of the base member having features for aligning a substrate on the interface pad. A substrate processing pallet can also include a base member; an interface pad attachable to the base member; an electrostatic chuck for gripping the substrate during processing; an energy storage system for storing energy to sustain the electrostatic chuck at sufficient charge to sustain grip the substrate during processing; and a conduit for transporting gas to a backside of the substrate to facilitate cooling of the substrate.
1. A substrate processing apparatus comprising:
(a) a substrate processing pallet including:
(i) a base member configured so that the pallet is moveable, with a substrate thereon, from a first chamber to a second chamber in a substrate processing system, the base member having a transport coupling surface configured to couple the base member to a pallet transport,
(ii) a thermal interface pad connected to the base member, the thermal interface pad formed of a composite material having a thermal conductivity that is substantially similar to a thermal conductivity of the base member, wherein the composite material includes a metal base plate,
(iii) an electrostatic chuck connected to the thermal interface pad, the electrostatic chuck configured to grip the substrate during processing,
(iv) an energy storage system moveable with the pallet, the energy storage system being configured for storing energy to sustain the electrostatic chuck at sufficient charge to sustain gripping the substrate during processing, and
(v) a gas transport mechanism connected to the base member and configured for transporting gas to a backside of the substrate to facilitate cooling of the substrate, the gas transport mechanism having a coupling to a gas source in the transport coupling surface;
(b) a load-lock module including a charging system configured to charge the substrate pallet; and
(c) a processing chamber coupled to the load-lock module, the processing chamber including at least one transport finger configured to supply gas to the substrate processing pallet, wherein the at least one transport finger is in communication with the gas transport mechanism of the substrate processing pallet.
2. The substrate processing apparatus of claim 1 wherein the base member comprises aluminum.
3. The substrate processing apparatus of claim 1 wherein the composite material comprises an alumina particulate and a polymer matrix.
4. The substrate processing apparatus of claim 1 wherein the pallet further comprises a removable, chemically resistant cover for facilitating cleaning.
5. The substrate processing apparatus of claim 4 wherein in the chemically resistant cover comprises a feature adapted for positioning and/or gripping the substrate.
6. The substrate processing apparatus of claim 1 further comprising an interface layer disposed between the pallet and a means for cooling the pallet to facilitate thermal conductance between the pallet and the means for cooling the pallet.
7. The substrate processing apparatus of claim 1 wherein the energy storage system comprises a high voltage capacitor.
8. The substrate processing apparatus of claim 7 wherein the high voltage capacitor comprises polypropylene film.
9. The substrate processing apparatus of claim 1 wherein the electrostatic chuck comprises a polyimide.
10. The substrate processing apparatus of claim 1 wherein the gas transport mechanism comprises a gas channel, a gas channel seal, a gas distribution system within the pallet, and a gas delivery outlet for uniform gas delivery.
11. The substrate processing apparatus of claim 1 wherein the electrostatic chuck further comprises a discharge circuit for automatically discharging the energy storage system.
12. The substrate processing apparatus of claim 1 , wherein the at least one transport finger engages with a suction cup included in the substrate processing pallet.
13. The substrate processing apparatus of claim 1 wherein the interface pad has substantially the same coefficient of thermal expansion as the base member.
14. The substrate processing apparatus of claim 1 wherein the energy storage system includes a shield coupling movable between a first and second positions where when in the first position the shield coupling communicates power to the energy storage system and when in the second position the shield coupling substantially prevents charged particles from entering a housing of the energy storage system.
15. The substrate processing apparatus of claim 14 , wherein the shield comprises a metal cover adapted to lift during charging and cover the conductor during processing.
16. The substrate processing apparatus of claim 14 further comprising:
a charger for charging the energy storage system; and
a conductor for conducting energy from the energy storage system;
wherein the shield coupling is configured for preventing charged particles from contacting the conductor when in the second position.
17. The substrate processing apparatus of claim 16 wherein the charger comprises a spring loaded contact providing power.
18. The substrate processing apparatus of claim 1 wherein the coupling is configured to couple to the gas source during processing of the pallet.
19. The substrate processing apparatus of claim 1 , wherein the interface pad is formed of polytetrafluoroethylene (PTFE).
20. The substrate processing apparatus according to claim 1 , wherein the composite material further includes an alumina particulate formed in a matrix of polytetrafluoroethylene (PTFE) that is laminated to the metal base plate.
21. The substrate processing apparatus according to claim 1 , wherein the composite material further includes a dielectric having a first thickness, wherein the dielectric is laminated to the metal base plate, and wherein the base plate has a second thickness greater than the first thickness.
22. The substrate processing apparatus according to claim 1 , wherein the metal base plate of the composite material is aluminum.
23. The substrate processing apparatus according to claim 1 , further comprising a bonding layer between the base member and the thermal interface pad.
24. The substrate processing apparatus according to claim 1 , wherein the load-lock module includes a water cooled plate in thermal communication with the pallet.
25. The substrate processing apparatus according to claim 1 , further comprising a sensor for measuring a gas pressure at the backside of the substrate.
26. The substrate processing apparatus according to claim 1 , wherein the substrate processing pallet includes a gas inlet and the at least one transport finger includes a gas hole, wherein the gas hole is aligned with the gas inlet.
27. The substrate processing apparatus according to claim 1 , wherein the load-lock module includes a lift plate configured to support the substrate processing pallet and a gas transport finger configured to supply gas to the substrate processing pallet, wherein the lift plate, in a first position, is connected to the charging system, and wherein the lift plate, in a second position, rests on the gas transport finger of the load-lock module.