Tracking and marking specimens having defects formed during laser via drilling
View Patent ↗A method and system increase processed specimen yield in the laser processing of target material that includes multiple specimens formed on a common substrate. Preferred embodiments implement a feature that enables storage in the laser processing system a list of defective specimens that have somehow been subject to error during laser processing. Once the common substrate has been completely processed, the system alerts an operator to the number of improperly processed specimens and gives the operator an opportunity to run a software routine, which in a preferred embodiment uses a laser to scribe a mark on the top surface of each improperly processed specimen.
1. A method of increasing processed specimen yield in the laser micromachining processing of target material that includes multiple specimens formed on a common substrate, comprising:
forming in a location of memory storage a record of relative movement between a laser beam and the common substrate;
forming a record of laser micromachining processing of the target material for the relative movement;
producing a recoverable error indication in response to an occurrence of a recoverable error condition detected during the laser micromachining processing; and
correlating the record of relative movement and the record of laser micromachining processing to determine which operation of laser micromachining processing took place when a recoverable error condition occurred.
2. The method of claim 1 , in which the record of laser micromachining processing includes a time indication associated with each operation of laser micromachining processing, the producing of a recoverable error indication includes assigning a time indication to the recoverable error indication, and the correlating includes matching within an error tolerance the time indication of occurrence of a recoverable error to a closest-in-time operation of laser micromachining processing.
3. The method of claim 1 , in which the record of relative movement includes a sequence of move commands.
4. The method of claim 1 , in which the multiple specimens include repetitive patterns.
5. The method of claim 4 , in which the repetitive patterns represent those of high density interconnect (HDI) or flexible (Flex) circuits.
6. The method of claim 1 , in which the multiple specimens include multiple packages.
7. The method of claim 6 , in which the multiple packages are integrated circuit packages.
8. The method of claim 1 , further comprising providing on the common substrate a mark indicating the specimen to which a recoverable error indication corresponds.
9. The method of claim 8 , in which the mark is placed on the specimen.
10. The method of claim 8 , in which the specimen includes electrical circuitry and the specimen fails electrical testing because of the mark.
11. The method of claim 1 , in which the laser micromachining processing includes removing a portion of the target material.
12. The method of claim 11 , in which the removing of a portion of the target material includes via drilling.
13. A system implemented to effect increased processed specimen yield in the laser micromachining processing of target material that includes multiple specimens formed on a common substrate, comprising:
a movement controller in response to a system control computer initiating relative movement between a laser beam and the common substrate;
a command subsystem operating to generate information relating to a path of relative movement between the laser beam and the common substrate;
memory for recording laser micromachining processing taking place at specific positions along the path of the relative movement; and
an error signal generator producing a recoverable error indication signal in response to an occurrence of a recoverable error condition and initiating recording of positions along the path of the relative movement that correspond to the occurrence of a recoverable error condition, thereby to identify and enable separation from the common substrate each of the specimens undergoing laser micromachining processing during the recoverable error condition.
14. The system of claim 13 , in which the system control computer, in response to the recoverable error indication signal, causes a laser beam to form on the common substrate a mark indicating each specimen to which the recoverable error indication signal corresponds.
15. The system of claim 13 , in which the information relating to a path of relative movement includes a sequence of move commands.
16. The system of claim 13 , further comprising an instruction signal causing placement of a mark indicating the specimen to which a recoverable error indication signal corresponds.
17. The system of claim 16 , in which the mark is placed on the specimen.
18. The system of claim 16 , in which the specimen includes electrical circuitry and the specimen fails electrical testing because of the mark.