IP Library Granted Patent US 7,776,495
Granted Patent B2
US 7,776,495 · App. 11/725,507 · Granted Aug 17, 2010

Semiconductor device and manufacturing method thereof

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Quick Facts
Patent No.
US 7,776,495
App. No.
11/725,507
Granted
Aug 17, 2010
Kind
B2
Abstract

A semiconductor device and a manufacturing method thereof in which the peripheral length of an aperture and the mechanical strength of cylinders in a cell can be increased without changing the occupation rate of patterns in the cell. By forming a slit in the middle of each mask pattern so as not to expose parts of wafer, the aperture of the wafer becomes nearly cocoon-shaped with a constriction in the middle. Thereby, the peripheral length of the aperture can be increased without changing the occupation rate of the mask patterns in a cell. Further, the shape of the bottom of the aperture also becomes nearly cocoon-shaped with a constriction in the middle, and therefore it is possible to increase the mechanical strength of cylinders.

Claims (12)

1. A semiconductor device manufacturing method of a deep sub-half micron semiconductor device, comprising the steps of:

coating a wafer with a resist,

replicating mask patterns on the resist with a photomask, and

forming cylinder type capacitors in a concave shape by photolithography, where each of the capacitors has a separate aperture defined by the respective mask patterns,

wherein each of the mask patterns includes a slit in the middle of each aperture so as not to expose parts of the wafer and so that each of apertures on the wafer is constricted in the middle in nearly a cocoon shape, and

wherein each of the mask patterns has a shape of a rectangle that is divided by the slit, and wherein each of the mask patterns further includes reentrant angles at a pair of opposite corners.

2. A semiconductor device manufacturing method of a deep sub-half micron semiconductor device, comprising the steps of:

coating a wafer with a resist;

replicating mask patterns on the resist with a photomask; and

forming cylinder type capacitors in a concave shape by photolithography,

wherein a slit is formed in the middle of each mask pattern on the photomask so as not to expose parts of the wafer, and each of apertures on the wafer is constricted in the middle in nearly a cocoon shape,

wherein each mask pattern has the shape of a rectangle with reentrant angles at a pair of opposite corners and is divided in the middle by the slit crossing both the reentrant angles.

Assignments (5)
CHANGE OF NAME Recorded Aug 24, 2016
From: PS5 LUXCO S.A.R.L.
To: LONGITUDE SEMICONDUCTOR S.A.R.L.
Reel/Frame 039793/0880 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 24, 2016
From: PS4 LUXCO S.A.R.L.
To: PS5 LUXCO S.A.R.L.
Reel/Frame 039818/0506 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 15, 2014
From: ELPIDA MEMORY, INC.
To: PS4 LUXCO S.A.R.L.
Reel/Frame 032900/0568 →
SECURITY AGREEMENT Recorded Jul 29, 2013
From: PS4 LUXCO S.A.R.L.
To: ELPIDA MEMORY INC.
Reel/Frame 032414/0261 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 20, 2007
From: HIROSHIMA, MASAHITO; NISHIDA, TAKASHI
To: EIPIDA MEMORY, INC.
Reel/Frame 019101/0364 →