IP Library › Granted Patent US 7,813,224
Granted Patent B2
US 7,813,224 · App. 11/728,726 · Granted Oct 12, 2010

Seismic source/receiver probe for shallow seismic surveying

Assignees: Underground Imaging Technologies, Inc.; BBN Technologies Corporation
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Quick Facts
Patent No.
US 7,813,224
App. No.
11/728,726
Granted
Oct 12, 2010
Kind
B2
Abstract

Systems and methods are implemented for evaluating underground structures and objects, particularly relatively shallow underground structures and objects, using a seismic or acoustic source signal and a resulting seismic or acoustic wave. A discrete or unitary apparatus incorporates both a seismic source transducer and a receiver transducer within a common housing or frame. A unitary seismic probe includes a ground engaging member and a seismic source mechanically coupled to the ground engaging member. The probe further includes a sensor assembly mechanically coupled to the ground engaging member and configured to sense ground vibrations resulting from an impact to the ground engaging member by the seismic source.

Claims (44)

1. A seismic sensor array, comprising;

a frame comprising ground supports configured to support the sensor array as it is pulled across the ground;

a plurality of discrete probes, each comprising;

a ground engaging member;

a seismic source mechanically coupled to the ground engaging member; and

a sensor assembly mechanically coupled to the ground engaging member and configured to sense ground vibrations resulting from an impact to the ground engaging member by the seismic source; and

a cross member configured to support pivoting mount arms for each probe so that the discrete probes are maintained in substantially fixed relative locations while allowing the probes to individually contact and engage the ground with a consistent force.

2. The sensor array of claim 1 , wherein the mount arms are secured to the frame such that they are isolated from one another both mechanically and electrically.

3. The sensor array of claim 1 , wherein the seismic source comprises a solenoid coupled to a capacitor.

4. The sensor array of claim 1 , wherein the seismic source comprises an anvil configured to be struck by a source of energy and transmit energy resulting from an anvil strike through the ground engaging member.

5. The sensor array of claim 4 , wherein the energy source comprises an activator configured to strike the anvil to generate a seismic or acoustic wave.

6. The sensor array of claim 4 , wherein the energy source comprises a spring biased plunger, positioned away from the anvil in a first state, and configured to cooperate with a solenoid configured to propel the plunger towards the anvil when energized.

7. The sensor array of claim 1 , wherein the ground engagement member comprises a wedge.

8. The sensor array of claim 1 , wherein the ground engagement member comprises a substantially flat portion arranged to contact the ground.

9. The sensor array of claim 1 , wherein the sensor assembly is configured to sense ground vibrations of a type and wavelength appropriate for imaging underground objects to a maximum depth of about 15 feet.

10. The sensor array of claim 1 , wherein the sensor assembly comprises an accelerometer.

11. The sensor array of claim 1 , wherein the sensor assembly comprises a velocity sensor or a geophone.

12. The sensor array of claim 1 , wherein the sensor assembly further comprises:

a generally cylindrical body;

a first end coupled to the ground engaging member; and

a second end comprising:

a generally flat surface for supporting an anvil; and

an aperture for supporting a sensor configured to sense ground vibrations resulting from the impact to the ground engaging member by the seismic source.

13. A method of probing the ground, comprising:

moving a frame that supports a plurality of discrete probes across the ground, the frame coupled to a cross member configured to support pivoting mount arms for each probe, each of the probes comprising:

a ground engaging member;

a seismic source mechanically coupled to the ground engaging member; and

a sensor assembly mechanically coupled to the ground engaging member and configured to sense ground vibrations resulting from an impact to the ground engaging member by the seismic source;

maintaining, using the pivoting mount arms, the probes in substantially fixed relative locations while allowing the probes to individually engage the ground with a consistent force;

contacting the ground with the ground engaging members;

generating a seismic or acoustic probe wave using the seismic sources;

transmitting the probe wave into the ground using the respective ground engaging members; and

sensing, using the respective ground engaging members, ground vibrations resulting from the transmitted probe wave.

14. The method of claim 13 , wherein the probing method facilitates imaging of underground objects to a maximum depth of about 15 feet.

15. The method of claim 13 , wherein the probe wave generation and ground vibration sensing facilitate sensing of ground vibrations of a type and wavelength appropriate for imaging underground objects to a maximum depth of 15 feet.

16. The method of claim 13 , wherein generating the probe wave comprises generating an impact force of no greater than about 500 lbs peak.

17. The method of claim 13 , wherein the generated probe wave provides a response bandwidth to about 3 kHz for depths up to about 15 feet.

18. The method of claim 13 , further comprising self-seating the ground engaging members using the probe wave transmitted to the respective ground engaging members.

19. The method of claim 13 , wherein probe waves are transmitted into the ground using each of the ground engaging members, one at a time, while sensing ground vibrations using some or all of the other ground engaging members.

20. The method of claim 13 , further comprising scanning a region of ground by repeating the contacting, generating, transmitting, and sensing processes at each of a plurality of ground locations.

21. The method of claim 20 , further comprising:

storing ground vibration sensing data;

recording position data while scanning; and

combining the ground vibration sensing data with the position data to develop a map of the scanned region.

Assignments (3)
CHANGE OF NAME Recorded Aug 22, 2024
From: RAYTHEON BBN TECHNOLOGIES CORP.
To: RTX BBN TECHNOLOGIES, INC.
Reel/Frame 068748/0419 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 8, 2010
From: KRUMHANSL, PETER A.; WHITTEMORE, DAVID
To: UNDERGROUND IMAGING TECHNOLOGIES, INC.; BBN TECHNOLOGIES CORPORATION
Reel/Frame 024499/0722 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 4, 2008
From: KRUMHANSL, PETER A.; WHITTEMORE, DAVID
To: UNDERGROUND IMAGING TECHNOLOGIES, INC.
Reel/Frame 021045/0150 →
Continuity (2)
Provisional Application 6078969800 · Apr 6, 2006
Related Publication 20070235250A1 · Oct 11, 2007