Nanomachining method and apparatus

1. In a nanomachining system having an SPM scanning probe and a translation apparatus coupled to provide translational motion of the SPM scanning probe, a method for moving material in a region of a workpiece, the method comprising:

performing one or more cut operations on a region of a workpiece, the one or more cut operations producing a deposit of debris in the region of the workpiece; and

removing the deposit of debris entirely from the region of the workpiece to another location including performing steps of:

(a) positioning the SPM scanning probe at a sweep-start position in the region of the workpiece, the sweep-start position lying on a first reference line;

(b) adjusting the SPM scanning probe along the Z-direction to a first Z-direction position;

(c) moving a first portion of the deposit of debris in a direction substantially orthogonal to the first reference line by translating the SPM scanning probe in a direction substantially orthogonal to the first reference line on which the sweep-start position lies; and

(d) moving additional portions of the deposit of debris by repeating steps (a)-(c) using additional sweep-start positions along the first reference line and by adjusting the Z-direction position of the SPM scanning probe.

2. The method of claim 1 wherein the region is a region being nanomachined.

3. The method of claim 1 wherein, in step (c), the scanning probe moves away from the sweep-start position along a substantially straight line of motion.

4. The method of claim 1 wherein, in step (c), the scanning probe moves away from the sweep-start position along a line of motion having a zig-zag pattern.

5. The method of claim 1 further comprising:

(e) moving still further additional portions of the deposit of debris in a direction substantially orthogonal to a second reference line by positioning the SPM scanning probe at a sweep-start position lying on the second reference line and performing steps (a)-(d) for the second reference line.

6. A nanomachining system comprising:

an SPM scanning probe;

a translation apparatus coupled to the SPM scanning probe to provide translational motion of the SPM scanning probe;

a controller coupled to operate the translation apparatus, the controller configured to:

perform one or more cut operations on a region of a workpiece, the one or more cut operations producing a deposit of debris in the region of the workpiece; and

remove the deposit of debris entirely from the region of the workpiece to another location including performing steps of:

(a) positioning the SPM scanning probe at a sweep-start position in a region of the workpiece, the sweep-start position lying on a first reference line, the first reference line being one among a plurality of reference lines passing through a common point of origin in the region;

(b) adjusting the SPM scanning probe along the Z-direction to a first Z-direction position;

(c) moving a first portion of the deposit of debris in a direction substantially orthogonal to the first reference line by translating the SPM scanning probe in a direction substantially orthogonal to the first reference line on which the sweep-start position lies; and

(d) moving additional portions of the deposit of debris by repeating (a)-(c) using additional sweep-start positions along the first reference line and by adjusting the Z-direction position of the SPM scanning probe.

7. The nanomachining system of claim 6 wherein the controller is further configure to move still further additional portions of the deposit of debris in a direction substantially orthogonal to a second reference line by positioning the SPM scanning probe at a sweep-start position lying on the second reference line and performing (a)-(d) for the second reference line.

8. A computer-program product embodied on a tangible computer-readable storage medium comprising program code configured to cause a computerized controller to operate an SPM scanning probe, the computer program code comprising:

first computer instructions which, when executed by the computerized controller, cause the computerized controller to:

perform one or more cut operations on are ion of a workpiece, the one or more cut operations producing a deposit of debris in the region of the workpiece; and

remove the deposit of debris entirely from the region of the workpiece to another location including performing steps of:

(a) positioning the SPM scanning probe at a sweep-start position in a region of the workpiece, the sweep-start position lying on a first reference line, the first reference line being one among a plurality of reference lines passing through a common point of origin in the region;

(b) adjusting the SPM scanning probe along the Z-direction to a first Z-direction position;

(c) moving a first portion of the deposit of debris in a direction substantially orthogonal to the first reference line by translating the SPM scanning probe in a direction substantially orthogonal to the first reference line on which the sweep-start position lies; and

(d) moving additional portions of the deposit of debris by repeating (a)-(c) using additional sweep-start positions along the first reference line and by adjusting the Z-direction position of the SPM scanning probe.

9. The computer-program product of claim 8 wherein the second first computer instructions which, when executed by the computerized controller, further cause the computerized controller to move still further additional portions of the deposit of debris in a direction substantially orthogonal to a second reference line by positioning the SPM scanning probe at a sweep-start position lying on the second reference line and performing (a)-(d) for the second reference line.