IP Library Patent Application 11730178
Patent Application
App. No. 11/730,178

Semiconductor device

Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US None
App. No.
11/730,178
Abstract

A semiconductor device includes a first transistor having a first gate oxide layer with a first thickness; a second transistor having a second gate oxide layer with a second thickness different from the first thickness; and at least one of a capacitor and a variable capacitance diode. The one of the capacitor and the variable capacitance diode includes a first electrode formed in a first area and a second area, a second electrode formed in the first area with the first gate oxide layer inbetween, and a third electrode formed in the second area with the second gate oxide layer inbetween.

Claims (8)

1 . A semiconductor device, comprising:

a first transistor having a first gate oxide layer with a first thickness;

a second transistor having a second gate oxide layer with a second thickness different from the first thickness; and

at least one of a capacitor and a variable capacitance diode, said one of the capacitor and the variable capacitance diode including a first electrode formed in a first area and a second area, a second electrode formed in the first area with the first gate oxide layer inbetween, and a third electrode formed in the second area with the second gate oxide layer inbetween.

2 . The semiconductor device according to claim 1 , wherein said second electrode has a first comb shape, said third electrode having a second comb shape nested inside one another with the first comb shape.

3 . The semiconductor device according to claim 1 , further comprising a semiconductor substrate having the first area, the second area, and the third area.

4 . The semiconductor device according to claim 3 , wherein said semiconductor substrate has the second area disposed adjacent to the first area, said third area being disposed adjacent to the first area on a side opposite to the second area.

5 . The semiconductor device according to claim 3 , wherein said semiconductor substrate includes one of a silicon substrate, a silicon-on-insulator substrate, and a silicon-on-sapphire substrate.

Assignments (1)
CHANGE OF NAME Recorded Jan 8, 2009
From: OKI ELECTRIC INDUSTRY CO., LTD.
To: OKI SEMICONDUCTOR CO., LTD.
Reel/Frame 022092/0903 →