Semiconductor layer, process for forming the same, and semiconductor light emitting device
View Patent ↗A semiconductor layer contains, as a principal constituent, a Group III-V semiconductor compound, which may be represented by the general formula: Al x Ga y In z N, wherein x represents a number satisfying the condition 0≦x<1, y represents a number satisfying the condition 0<y<1, and z represents a number satisfying the condition 0<z<1, with the proviso that x+y+z=1. The semiconductor layer is formed with a laser assisted metalorganic vapor phase epitaxy technique. A semiconductor light emitting device comprises the semiconductor layer and may be constituted as a semiconductor laser or a light emitting diode.
1. A process for forming a semiconductor layer, comprising the steps of:
forming a semiconductor layer on a base plate by use of a laser assisted metalorganic vapor phase epitaxy technique, the semiconductor layer containing, as a principal constituent, a Groups III-V semiconductor compound, which may be represented by the general formula:
Al x Ga y In z N
wherein x represents a number satisfying the condition 0≦x<1, y represents a number satisfying the condition 0<y<1, and z represents a number satisfying the condition 0<z<1, with the proviso that x+y+z=1.
2. A process for forming a semiconductor layer as defined in claim 1 wherein a laser beam is irradiated to the base plate from at least one direction, such that the laser beam passes just above the base plate and in a direction approximately parallel with a base plate surface of the base plate,
supply of film formation raw materials with respect to the base plate is performed, while the laser beam is being thus irradiated to the base plate, and
the semiconductor layer is thereby formed.
3. A process for forming a semiconductor layer as defined in claim 2 wherein the irradiation of the laser beam to the base plate is performed with a laser beam profile, such that a distribution of a laser beam intensity, which distribution is taken in the direction parallel with the base plate surface, is approximately uniform, and such that the distribution of the laser beam intensity, which distribution is taken in the direction normal to the base plate surface, is the distribution approximately represented by the Gaussian distribution, and
the laser beam is irradiated to the base plate, such that a peak of the distribution of the laser beam intensity, which distribution is taken in the direction normal to the base plate surface, is present within the range of at most 2 mm from the base plate surface, which range is taken in the direction normal to the base plate surface.