Light emitting diode chip
A light emitting diode (LED) chip including: a substrate; and a light emitting structure including a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer, sequentially deposited on the substrate, in which when a length of the substrate is L and a width of the substrate is W, L/W>10.
1 . A light emitting diode (LED) chip comprising:
a substrate; and
a light emitting structure including a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer, sequentially deposited on the substrate,
wherein when a length of the substrate is L and a width of the substrate is W, L/W>10.
2 . The LED chip of claim 1 , wherein L/W>20.
3 . The LED chip of claim 1 , wherein a bottom surface of the substrate and sides of the LED chip are main light output surfaces.
4 . The LED chip of claim 1 , wherein L is more than 5 mm and W is less than 500 μm.
5 . The LED chip of claim 1 , wherein the first conductive semiconductor layer is n type semiconductor and the second conductive semiconductor layer is p type semiconductor.
6 . The LED chip of claim 1 , wherein the substrate is formed of a material selected from a group consisting of GaN, SiC, GaAs, Gap, ZnO, and sapphire.
7 . The LED chip of claim 1 , wherein the first conductive semiconductor layer, the active layer, and the second conductive semiconductor layer are formed of III family nitride semiconductor.
8 . The LED chip of claim 1 , further comprising:
a first electrode formed on the bottom surface of the substrate; and
a second electrode formed on the second conductive semiconductor layer to be opposite to the first electrode.
9 . The LED chip of claim 8 , wherein the first electrode comprises a pad portion and at least one line portion extended lengthwise to the LED chip.
10 . The LED chip of claim 9 , wherein the first electrode comprises:
two line portions extended lengthwise to the LED chip; and
a pad portion disposed between the two line portions and connecting the two-line portions.
11 . The LED chip of claim 1 , further comprising:
a first electrode formed on a part of the first conductive semiconductor layer; and
a second electrode formed on the second conductive semiconductor layer,
wherein the first electrode and the second electrode are disposed on the same side of the LED chip.
12 . The LED chip of claim 11 , the LED chip is a flip chip.