IP Library › Patent Application 11737580
Patent Application
App. No. 11/737,580

ALIGNMENT WITH THIN BONDING LAYER OF OPTICAL COMPONENTS

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Quick Facts
Patent No.
US None
App. No.
11/737,580
Abstract

An optical component is attached to a mounting block and the mounting block is attached to a carrier. The optical component is actively aligned by adjusting the optical component with respect to the mounting block and the mounting block with respect to the carrier. An adhesive used for the attachments can be in a layer of 5 microns or less to reduce thermal degradation and effects of thermal expansion.

Claims (14)

1 . A method of aligning a plurality of optical components within an optical system, the method comprising:

attaching a first mounting block to a carrier using a first thin layer of adhesive material on a first surface of the first mounting block and a second thin layer of adhesive material on a corresponding portion of a second surface of the carrier;

attaching a first optical component to the first mounting block using a third thin layer of adhesive material on a third surface of the optical component, wherein the third surface is substantially perpendicular to a plane of the carrier, and a fourth thin layer of adhesive material on a corresponding portion of a fourth surface of the first mounting block; and

actively aligning the first optical component by adjusting the position of the first mounting block in the plane of the carrier by positioning the mounting block on the carrier and adjusting the position of the first optical component in a direction perpendicular to the plane of the carrier by positioning the optical component with respect to the first mounting block.

2 . The method of claim 1 , wherein the optical alignment is determined by the position of the optical component that maximizes the coupling of a light source passing through one or more optical components to a target.

3 . The method of claim 1 , wherein the adhesive material comprises solder.

4 . The method of claim 1 wherein the solder is heated prior to alignment by passing an electrical current though the solder.

5 . The method of claim 1 , wherein the adhesive material includes sol-gel.

6 . The method of claim 1 , wherein, after attachment, the first and second layers of adhesive material have a combined thickness of 5 microns or less.

7 . The method of claim 5 , wherein the third and fourth layers of adhesive material have a combined thickness of about 5 microns or less.

8 . The method of claim 1 , wherein the third and fourth layers of adhesive material have a combined thickness of about 5 microns or less.

9 . The method of claim 1 , wherein the first optical component includes one of the set consisting of a lens, a mirror, a prism, and a diffraction grating.

10 . The method of claim 1 , further comprising attaching a second optical component to a second mounting block and the second mounting block to the carrier in a manner substantially the same as the attachment of the first optical component to the first mounting block and the first mounting block to the carrier.

11 . The method of claim 1 , wherein each of the plurality of optical components includes one of the set consisting of a lens, a mirror, a prism, and a diffraction grating.

Assignments (2)
CONFIRMATION OF GRANT OF SECURITY INTEREST Recorded Jun 26, 2008
From: EM4, INC.
To: MMV FINANCE INC.
Reel/Frame 021156/0239 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 28, 2007
From: ROSIEWICZ, ALEX; ZHU, NINGHUI
To: EM4, INC.
Reel/Frame 020169/0810 →