IP Library Granted Patent US 7,673,268
Granted Patent B2
US 7,673,268 · App. 11/737,759 · Granted Mar 2, 2010

Method and system for incorporating via redundancy in timing analysis

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Quick Facts
Patent No.
US 7,673,268
App. No.
11/737,759
Granted
Mar 2, 2010
Kind
B2
Abstract

A method of conducting timing analysis on an integrated circuit design includes performing a first routing operation on the design to generate a first routed design that includes redundant vias, and storing the first routed design in a first design database, and performing a second routing operation on the synthesized design to generate a second routed design that does not include redundant vias, and storing the second routed design in a second design database. Then, extractions are performed on the first and second designs and delay calculations are performing on the first and second extractions files. The first and second delay calculations are compared to determine a delay difference between the first and second designs and timing analysis is performed using the delay difference.

Claims (36)

1. A method of conducting timing analysis on an integrated circuit design, comprising:

performing physical synthesis on the integrated circuit design;

performing a first routing operation on the synthesized design to generate a first routed design that includes redundant vias, and storing the first routed design in a first design database;

performing a second routing operation on the synthesized design to generate a second routed design that does not include redundant vias, and storing the second routed design in a second design database;

performing extractions on the first and second designs using the first and second design databases to generate first and second extraction files using a system for performing timing analysis;

performing first and second delay calculations on the first and second extractions files;

comparing the first and second delay calculations to determine a delay difference between the first and second designs; and

performing timing analysis using the delay difference.

2. The method of conducting timing analysis according to claim 1 , further comprising:

ascertaining that results of the timing analysis do not meet a timing requirement;

performing a further routing operation on the second routed design to generate a third routed design and storing the third routed design in a third database;

performing extraction on the third routed design using the third database to generate a third extraction file;

performing delay calculations on the third extraction file;

comparing the first and third delay calculations to determine a new delay difference between the first and third designs; and

performing timing analysis using the new delay difference.

3. The method of conducting timing analysis of claim 1 , wherein performing the timing analysis further includes incorporating the delay difference into the second extraction file.

4. The method of conducting timing analysis of claim 1 , wherein the first delay calculation generates a first minimum delay and the second delay calculation generates a second minimum delay, and a delay difference thereof is used for a hold timing check.

5. The method of conducting timing analysis of claim 1 , wherein the first delay calculation generates a first maximum delay and the second delay calculation generates a second maximum delay, and a delay difference thereof is used for a setup timing check.

6. The method of conducting timing analysis of claim 1 , wherein the step of performing timing analysis includes performing a static timing analysis, electromigration analysis, and signal integrity check.

7. The method of conducting timing analysis of claim 1 , further comprising the steps of:

performing GDS integration on the first design using the first design database to generate a GDS file; and

performing chip level static timing analysis on the GDS file.

8. The method of conducting timing analysis of claim 7 , further comprising the step of performing design rules checks using the GDS file.

9. The method of conducting timing analysis of claim 8 , further comprising the step of performing a rule-based tiling operation on the GDS file.

10. The method of conducting timing analysis of claim 1 , wherein the first routing operation generates the first routed design and the first routed design includes redundant vias and fat vias.

11. A system for conducting timing analysis on an integrated circuit design, comprising:

a router for routing the integrated circuit design wherein the router generates a first routed design that includes redundant vias and a second routed design that does not include redundant vias;

an extraction module for extracting parasitics from the first and second routed designs;

a delay calculation module for calculating a plurality of first delay values and a plurality of second delay values respectively for each of the first and second designs;

a delay difference calculation module for comparing the first and second delay values and generating a plurality of delay differences therefrom; and

a timing analysis module for performing a timing analysis on the first design using the plurality of delay differences.

12. The system for conducting timing analysis on an integrated circuit design of claim 11 , wherein the plurality of first delay values and the plurality of second delay values each include a minimum delay and a maximum delay for a timing stage in each of the first and second designs.

13. The system for conducting timing analysis on an integrated circuit design of claim 12 , wherein the plurality of delay differences includes a maximum delay difference, which is obtained from a difference between a maximum delay from the plurality of first delay values and a maximum delay from the plurality of second delay values.

14. The system for conducting timing analysis on an integrated circuit design of claim 13 , wherein the maximum delay difference is incorporated into the maximum delay from the plurality of second delay values before performing the timing analysis for a setup check.

15. The system for conducting timing analysis on an integrated circuit design of claim 12 , wherein the plurality of delay differences includes a minimum delay difference, which is obtained from a difference between a minimum delay from the plurality of first delay values and a minimum delay from the plurality of second delay values.

16. The system for conducting timing analysis on an integrated circuit design of claim 15 , wherein the minimum delay difference is incorporated into the minimum delay from the plurality of second delay values before performing the timing analysis for a hold check.

Assignments (39)
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040925 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Feb 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V. F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 052917/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040928 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Jan 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 052915/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 037486 FRAME 0517. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Dec 10, 2019
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 053547/0421 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042762 FRAME 0145. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051145/0184 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051030/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042985 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0387 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050745/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
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CORRECTIVE ASSIGNMENT TO CORRECT THE TO CORRECT THE APPLICATION NO. FROM 13,883,290 TO 13,833,290 PREVIOUSLY RECORDED ON REEL 041703 FRAME 0536. ASSIGNOR(S) HEREBY CONFIRMS THE THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS.. Recorded Feb 20, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: SHENZHEN XINGUODU TECHNOLOGY CO., LTD.
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CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042985/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
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CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE PATENTS 8108266 AND 8062324 AND REPLACE THEM WITH 6108266 AND 8060324 PREVIOUSLY RECORDED ON REEL 037518 FRAME 0292. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Feb 1, 2017
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
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CORRECTIVE ASSIGNMENT TO CORRECT THE NATURE OF CONVEYANCE LISTED CHANGE OF NAME SHOULD BE MERGER AND CHANGE PREVIOUSLY RECORDED AT REEL: 040652 FRAME: 0180. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER AND CHANGE OF NAME. Recorded Jan 12, 2017
From: FREESCALE SEMICONDUCTOR INC.
To: NXP USA, INC.
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CHANGE OF NAME Recorded Nov 8, 2016
From: FREESCALE SEMICONDUCTOR INC.
To: NXP USA, INC.
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RELEASE OF SECURITY INTEREST Recorded Nov 7, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 040928/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 21, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V., F/K/A FREESCALE SEMICONDUCTOR, INC.
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CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12092129 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Jul 14, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
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SUPPLEMENT TO THE SECURITY AGREEMENT Recorded Jun 16, 2016
From: FREESCALE SEMICONDUCTOR, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC.
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SECURITY AGREEMENT SUPPLEMENT Recorded Mar 7, 2016
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ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 13, 2016
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ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 12, 2016
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PATENT RELEASE Recorded Dec 21, 2015
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PATENT RELEASE Recorded Dec 21, 2015
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From: KASHYAP, MADHUR; DUTTA, ARIJIT
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