IP Library Granted Patent US 8,066,087
Granted Patent B2
US 8,066,087 · App. 11/745,726 · Granted Nov 29, 2011

Thermally stable ultra-hard material compact constructions

Assignee: Smith International, Inc.
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Quick Facts
Patent No.
US 8,066,087
App. No.
11/745,726
Granted
Nov 29, 2011
Kind
B2
Abstract

Thermally stable ultra-hard compact constructions comprise a polycrystalline diamond body substantially free of a catalyst material, and a substrate that is joined thereto. The substrate can be ceramic, metallic, cermet and combinations thereof, and can be joined to the body by a braze material or other material that forms an attachment bond at high pressure/high temperature conditions. The body and substrate are specially formed having complementary interfacing surface features to facilitate providing an improved degree of attachment therebetween. The complementary surface features can in the form of openings and projections, e.g., one of the body or substrate can comprise one or more openings, and the other of the body or substrate can comprise one or more projections, disposed within or extending from respective interfacing surfaces. The complementary surface features operate to resist unwanted delamination between the body and substrate, thereby extending effective service life of the construction.

Claims (17)

1. A method for making a thermally stable ultra-hard material compact construction comprising a body and a substrate, the method comprising the steps of:

forming a thermally stable polycrystalline diamond body by removing substantially all of a catalyst material therefrom from a polycrystalline diamond body, wherein the entire polycrystalline diamond body is immersed in a leaching agent to remove substantially all of the catalyst material;

aligning complementary surface features positioned along interfacing surfaces of the thermally stable polycrystalline diamond body and substrate with one another so that they engage one another; and

joining the thermally stable polycrystalline diamond body to the substrate.

2. The method of claim 1 , further comprising:

forming the polycrystalline diamond body, wherein the step of forming the polycrystalline diamond body comprises:

loading a plurality of diamond grains adjacent to a first substrate, wherein the first substrate comprises the catalyst material;

subjecting the plurality of diamond grains and the first substrate to high pressure, high temperature processing, such that the polycrystalline diamond body is formed having the first substrate attached thereto; and

removing the first substrate from the polycrystalline diamond body.

3. The method as recited in claim 1 wherein the step of joining is achieved at high pressure/high temperature conditions, and an intermediate material is selected to form an attachment bond between the substrate and body at such conditions.

4. The method as recited in claim 1 further comprising the step of forming the complementary surface features in the body and the substrate, wherein the complementary surface features comprise at least one opening and at least one projection.

5. The method as recited in claim 4 wherein the at least one opening is disposed at least partially through the body and is formed before the catalyst material is removed therefrom.

6. The method as recited in claim 5 wherein the at least one opening extends completely through the body from its interfacing surface to an opposite body surface, such that the at least one opening extends through the entire thickness of the body.

7. The method as recited in claim 6 wherein at least one projection is at least partially disposed within the opening.

8. The method as recited in claim 7 wherein during the step of joining, an intermediate material is used to attach the substrate to the body.

9. The method as recite in claim 8 wherein the intermediate material is a braze material.

10. The method as recited in claim 8 wherein the step of joining is achieved at high pressure/high temperature conditions, and the intermediate material is selected to form an attachment bond between the substrate and body at such conditions.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 11, 2007
From: GRIFFO, ANTHONY; KESHAVAN, MADAPUSI K.; ZHANG, YOUHE; SHEN, YUELIN; JANSSEN, MICHAEL
To: SMITH INTERNATIONAL, INC.
Reel/Frame 019410/0748 →
Continuity (2)
Provisional Application 60799104 · May 9, 2006
Related Publication 20080142276A1 · Jun 19, 2008