Compliant Bumps for Integrated Circuits Using Carbon Nanotubes
Complaint bumps used for interconnections between integrated circuit chips are made with carbon nanotubes.
1 . An integrated circuit (“IC”) comprising a plurality of compliant bumps for physically contacting and electrically interconnecting to electrical connections on another device, wherein the compliant bumps comprise carbon nanotubes (“CNTs”).
2 . The IC as recited in claim 1 , wherein the CNTs are single-walled.
3 . The IC as recited in claim 1 , wherein the CNTs are multi-walled.
4 . The IC as recited in claim 1 , wherein the compliant bumps comprise a composite that comprise CNTs.
5 . The IC as recited in claim 1 , wherein the IC is a flip chip.
6 . The IC as recited in claim 1 , wherein the IC comprises a microprocessor.
7 . The IC as recited in claim 1 , wherein heads of the compliant bumps comprise a metal layer covering the CNTs.
8 . The IC as recited in claim 7 , wherein the metal layer comprises gold.
9 . The IC as recited in claim 7 , wherein the metal layer comprises chromium.
10 . A module comprising:
a substrate; and
a plurality of CNT-containing interconnect bumps mounted on the substrate electrically connecting to electrical connections in the substrate, the bumps covered with a metal cap.
11 . The module as recited in claim 10 , wherein the CNTs are single-walled.
12 . The module as recited in claim 10 , wherein the CNTs are multi-walled.
13 . The module as recited in claim 10 , wherein the compliant bumps comprise a composite that comprises CNTs.
14 . The module as recited in claim 10 , wherein the module is a flip chip.
15 . The module as recited in claim 10 , wherein the module comprises a microprocessor.
16 . The module as recited in claim 10 , wherein the metal layer comprises gold.
17 . The module as recited in claim 10 , wherein the metal layer comprises chromium.