IP Library Patent Application 11755498
Patent Application
App. No. 11/755,498

MAGNETOELECTRONIC DEVICE HAVING ENHANCED PERMEABILITY DIELECTRIC AND METHOD OF MANUFACTURE

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Patent No.
US None
App. No.
11/755,498
Abstract

A magnetoelectronic device structure 20 includes programming lines 26 and 28 and a magnetoelectronic device 24 between the programming lines 26 and 28. In one embodiment, layers 38, 40, and 42 of a colloidal dispersion of an electrically insulating material and magnetic particles are positioned between the magnetoelectronic device 24 and the programming lines 26 and 28. The magnetic particles cause the colloidal dispersion to have an enhanced magnetic permeability property. The layers 38, 40, and 42 are disposed by a spin coating technique.

Claims (34)

1 . A method for making a magnetoelectronic device structure comprising:

providing a magnetoelectronic device;

forming a colloidal dispersion of an electrically insulating material and magnetic particles, said magnetic particles causing said colloidal dispersion to have an enhanced magnetic permeability property; and

spin coating said colloidal dispersion adjacent said magnetoelectronic device.

2 . A method as claimed in claim 1 further comprising utilizing a liquid source to form a dielectric film as said electrically insulating material.

3 . A method as claimed in claim 2 further comprising selecting a spin-on dielectric formulation for said liquid source.

4 . A method as claimed in claim 1 wherein said forming operation comprises uniformly distributing said magnetic particles in said electrically insulating material.

5 . A method as claimed in claim 1 further comprising selecting said magnetic particles from a group consisting of iron, cobalt, nickel, and alloys thereof.

6 . A method as claimed in claim 1 further comprising utilizing said magnetic particles having a passivated surface.

7 . A method as claimed in claim 1 further comprising utilizing magnetic nanoparticles as said magnetic particles.

8 . A method as claimed in claim 1 wherein said forming operation comprises producing said colloidal dispersion to include a concentration that is between approximately twenty-five and approximately thirty percent of said magnetic particles relative in said electrically insulating material.

9 . A method as claimed in claim 1 wherein:

said method further comprises producing a programming line; and

said spin coating operation includes disposing a first layer of said colloidal dispersion between said programming line and said magnetoelectronic device.

10 . A method as claimed in claim 9 wherein said programming line is a first programming line underlying said magnetoelectronic device, and said method further comprises:

disposing a second layer of said colloidal dispersion over said magnetoelectronic device; and

producing a second programming line overlying said second layer of said colloidal dispersion.

11 . A magnetoelectronic device structure comprising:

a first programming line;

a second programming line;

a magnetoelectronic device between said first and second programming lines; and

a colloidal dispersion of an electrically insulating material and magnetic particles positioned between said first programming line and said magnetoelectronic device and between said magnetoelectronic device and said second programming line, said magnetic particles causing said colloidal dispersion to have an enhanced magnetic permeability property.

12 . A structure as claimed in claim 11 wherein said electrically insulating material comprises a spin-on dielectric formulation.

13 . A structure as claimed in claim 11 wherein said magnetic particles comprise magnetic nanoparticles.

14 . A structure as claimed in claim 11 wherein said magnetic particles comprise passivated magnetic particles.

15 . A structure as claimed in claim 11 wherein said magnetic particles are selected from a group consisting of iron, cobalt, nickel, and alloys thereof.

16 . A structure as claimed in claim 11 wherein said colloidal dispersion comprises a concentration of said magnetic particles of between approximately twenty-five and approximately thirty percent of said magnetic particles relative in said electrically insulating material.

17 . A method for making a magnetoelectronic device structure comprising:

providing a magnetoelectronic device;

forming a colloidal dispersion that includes a dielectric material and magnetic particles by uniformly distributing said magnetic particles in a liquid source used to form said dielectric material, said magnetic particles causing said colloidal dispersion to have an enhanced magnetic permeability property; and

spin coating said colloidal dispersion adjacent said magnetoelectronic device.

18 . A method as claimed in claim 17 further comprising selecting a spin-on glass formulation for said liquid source.

19 . A method as claimed in claim 17 further comprising utilizing said magnetic particles having a passivated surface.

20 . A method as claimed in claim 17 wherein said spin coating comprises spin coating more than one layer of colloidal dispersion wherein said more than one layer includes different concentrations of magnetic particles corresponding to a desired permeability property for each said layer.

Assignments (15)
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042762 FRAME 0145. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051145/0184 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051030/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0387 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042985 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050745/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042985/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042762/0145 →
PATENT RELEASE Recorded Aug 17, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 039707/0471 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12092129 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Jul 14, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039361/0212 →
SECURITY AGREEMENT SUPPLEMENT Recorded Mar 7, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 038017/0058 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037354/0655 →
RELEASE OF SECURITY INTEREST Recorded Jul 30, 2010
From: CITIBANK, N.A.
To: EVERSPIN TECHNOLOGIES, INC.
Reel/Frame 024767/0398 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 9, 2009
From: FREESCALE SEMICONDUCTOR, INC.
To: EVERSPIN TECHNOLOGIES, INC.
Reel/Frame 022366/0467 →
SECURITY AGREEMENT Recorded Nov 1, 2007
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS COLLATERAL AGENT
Reel/Frame 020045/0448 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 30, 2007
From: KYLER, KELLY W.; NAGEL, KERRY J.; SHAH, PIYUSH M.
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 019357/0266 →