Microprocessor die with integrated voltage regulation control circuit

1. An integrated circuit (IC) die, comprising:

a microprocessor; and

a control circuit to control elements of a voltage regulator to supply power to the microprocessor;

wherein:

the control circuit includes a plurality of sensors,

the microprocessor includes a plurality of sensor locations in the microprocessor,

one or more of the sensors are located at each of said sensor locations in the microprocessor; and

one or more of said sensors at said plurality of sensor locations are for reading one or more buffers and/or registers of the microprocessor.

2. The IC die of claim 1 , wherein at least some of the sensors are analog sensors.

3. The IC die of claim 2 , wherein some of the sensors are digital sensors.

4. The IC die of claim 1 , wherein at least some of the sensors are digital sensors.

5. The IC die of claim 1 , wherein the control circuit is laid out in accordance with an analog architecture.

6. The IC die of claim 1 , wherein the control circuit is laid out in accordance with a digital architecture.

7. The IC die of claim 6 , wherein the control circuit includes a core to execute instructions.

8. The IC die of claim 6 , wherein the control circuit includes an arithmetic logic block.

9. The IC die of claim 6 , wherein the control circuit includes a timer block.

10. The IC die of claim 6 , wherein the control circuit includes an output driving block.

11. The IC die of claim 6 , wherein the control circuit includes a fuse block.

12. A system comprising:

an IC die which includes a microprocessor and a control circuit for a voltage regulator; and

a plurality of power phase circuits, each of the power phase circuits including:

a pair of field effect transistors (FETs) coupled in series between a power terminal and ground;

an inductor coupled to a node at which the FETs are coupled to each other; and

at least one driver coupled to the control circuit to receive a control signal from the control circuit, the at least one driver also coupled to at least one of the FETs to selectively activate the FETs;

wherein:

the control circuit includes a plurality of sensors,

the microprocessor includes a plurality of sensor locations in the microprocessor,

one or more of the sensors are located at each of said sensor locations in the microprocessor; and

one or more of said sensors at said plurality of sensor locations are for reading one or more buffers and/or registers of the microprocessor.

13. A system comprising:

a die comprising a microprocessor; and

a chipset in communication with the microprocessor;

wherein the die includes a control circuit to control elements of a voltage regulator to supply power to the microprocessor;

wherein:

the control circuit includes a plurality of sensors,

the microprocessor includes a plurality of sensor locations in the microprocessor,

one or more of the sensors are located at each of said sensor locations in the microprocessor; and

one or more of said sensors at said plurality of sensor locations are for reading one or more buffers and/or registers of the microprocessor.

14. The system of claim 12 , further comprising a voltage converter coupled to the control circuit to supply power to the control circuit.

15. The system of claim 12 , further comprising at least one capacitor coupled between the inductors and ground.

16. The system of claim 13 , further comprising a voltage converter coupled to the control circuit to supply power to the control circuit, said voltage converter separate from said voltage regulator.

17. The IC die of claim 1 , wherein at least one of the sensors detects a voltage condition at at least one of said sensor locations in the microprocessor.

18. The IC die of claim 1 , wherein at least one of the sensors detects an electrical current condition at at least one of said sensor locations in the microprocessor.

19. The IC die of claim 1 , wherein at least one of the sensors detects a thermal condition at at least one of said sensor locations in the microprocessor.

20. The IC die of claim 1 , wherein at least one of the sensors detects a microprocessor activity condition at at least one of said sensor locations in the microprocessor.

21. The system of claim 12 , further comprising a voltage converter coupled to the control circuit to supply power to the control circuit, said voltage converter separate from said power phase circuits.