Process of forming an electronic device including a plurality of singulated die
View Patent ↗An electronic device can include a first die having a first terminal at a first front side, and a second die having a second terminal at a second front side and a through via. In one aspect, a process of forming the electronic device includes supplying a second substrate including a die location of the second die. The process can also include attaching the second substrate to a handling substrate and singulating the second die from the second substrate before removing the handling substrate. In another aspect, the handling substrate can include a rigid substrate. The process can include orienting the front side of the first die and a back side of the second substrate front-to-back with respect to each other. In yet another aspect, the first terminal is electrically connected to the through via and the second terminal. In one embodiment, the electronic device can include a third die.
1. A process of forming an electronic device comprising:
attaching a first substrate to a first handling substrate, wherein the first substrate includes a bulk semiconductor material, a first plurality of die locations including a first die location including a first terminal at a first front side surface of the first die location, and, after attaching the first substrate, the first front side surface is adjacent to the first handling substrate;
removing a portion of the first substrate after attaching the first substrate to expose a first back side surface, wherein the first back side surface is separated from a first front side surface by a first thickness;
forming a first through via at the first die location;
forming a first electrical connection between a second terminal at a second front side surface of a second die and the first terminal of the first die, wherein:
forming the first electrical connection includes electrically connecting the second terminal and the first through via to each other;
the second die is a singulated die during formation of the first electrical connection;
the second die includes a second back side surface spaced apart from a second front side surface by a second thickness; and
the first thickness is less than half the second thickness;
singulating the first die from the first substrate while the first handling substrate is attached to the first substrate; and
removing the first handling substrate after singulating the first die from the first substrate.
2. The process of claim 1 , wherein forming the first electrical connection between the first terminal and the second terminal further includes orienting the second die such that the second front side surface and the first back side surface are front-to-back with respect to each other.
3. The process of claim 1 , wherein:
forming the first electrical connection further comprises forming a second electrical connection between another second terminal at the second front side surface of the second die and another first terminal at the first back side surface of the first die, wherein the first and second electrical connections are spaced apart from side edges of the first and second die; and
after singulating the first die, a void is disposed between and immediately adjacent to the first and second electrical connections along the first front side surface of the first substrate and the second back side surface of the second substrate.
4. The process of claim 1 , wherein after singulating the first die, the second die has the second thickness.
5. The process of claim 1 , wherein:
prior to attaching the first substrate to the first handling substrate, a first transistor lies at the first front side surface; and
prior to forming the first electrical connection between the second terminal at the second front side surface of the second die and the first terminal of the first die, a second transistor lies at the second front side surface.
6. The process of claim 1 , wherein:
removing a portion of the first substrate comprises removing only a portion of a bulk semiconductor material of the first substrate to leave a remaining portion of the bulk semiconductor material, and after removing the portion of the first substrate, the first thickness is less than approximately 90 microns; and
forming an opening through only a portion of the first thickness of the first substrate, wherein the opening extends through the remaining portion of the bulk semiconductor material.
7. The process of claim 1 , further including:
after removing the first handling substrate, attaching a third substrate to a second handling substrate, wherein the third substrate includes a third plurality of die including a third die location, a third terminal lies at a third front side surface of the third die location;
removing a portion of a third substrate to expose a third back side surface, wherein after removing the portion of the third substrate, the third back side surface is separated from a third front side surface by a third thickness;
forming a second through via at the third die location;
forming a second electrical connection between the second terminal and the third terminal wherein forming the second electrical connection includes electrically connecting the second terminal and the second through via at the third die location to each other; and
removing the second handling substrate, after forming the second electrical connection between the second and third terminals.
8. The process of claim 7 , wherein the second thickness and the third thickness have substantially a same value.
9. A process of forming an electronic device comprising:
attaching a first substrate to a handling substrate wherein the first substrate includes a first plurality of die locations including a first die location from which a first die can be subsequently singulated, wherein:
the first die includes a first front side surface and a first back side surface;
a first terminal and a transistor component region of the first die lie at the first front side surface; and
the handling substrate is a rigid substrate;
forming a first through via that extends from the first terminal towards the first back surface and through a remaining thickness of the first die wherein the first through via is electrically connected to the first terminal; and
flowing solder to form a first electrical connection between a second terminal at a second front side surface of a second die and the first terminal, and a second electrical connection between another second terminal at the second front side surface of the second die and another first terminal at the front side of the first die, wherein forming the electrical connection includes orienting the second die such that the second front side surface and the first back side surface are adjacent to each other,
wherein after flowing the solder, a void is disposed between the first and second electrical connections along the first front side surface of the first substrate and the second back side surface of the second substrate.
10. The process of claim 9 , wherein flowing the solder includes electrically connecting the first through via and the second terminal to each other.
11. The process of claim 9 , further including:
singulating the first die from the first substrate after flowing the solder; and
removing the first die from the handling substrate.
12. The process of claim 11 , further including:
orienting the first die such that the first front side surface and a third back side surface of a third die location of a third substrate are front-to-back with respect to each other; and
electrically connecting the first terminal at the first front side surface and a third terminal at a third front side surface opposite the third back side surface of the third substrate after removing the handling substrate from the first die, wherein electrically connecting the first terminal includes electrically connecting a second through via in the third die and the first terminal at the first front side surface to each other.
13. The process of claim 12 , further including electrically connecting the second terminal of the second die and the third terminal of the third die, wherein electrically connecting the second terminal includes electrically connecting the second through via and the second terminal to each other.
14. The process of claim 12 , further including:
removing a portion of the third substrate wherein after removing the portion of the third substrate, the third substrate has a third thickness; and
singulating the third die from the third substrate after removing the portion of the third substrate, wherein after singulating the third die:
the second die has a second thickness; and
the third thickness less than half the second thickness.
15. The process of claim 14 , wherein after singulating the third die, the second die is thicker than the first die and the third die.
16. The process of claim 9 , further comprising removing a portion of the first substrate after attaching the first substrate to the handling substrate and before forming the first through via, wherein after removing the portion of the first substrate, a remaining portion of the first substrate has a thickness is less than approximately 90 microns.
17. The process of claim 9 , wherein flowing the solder is performed after forming the first through via.
18. The process of claim 9 , further comprising plating a conductive layer within first through via before flowing the solder.
19. The process of claim 1 , wherein the second thickness is in a range of approximately 200 microns to approximately 400 microns
20. The process of claim 1 , wherein forming the first electrical connection comprises plating a conductive layer.