System and method for forming an integrated barrier layer
An apparatus and method for forming an integrated barrier layer on a substrate is described. The integrated barrier layer comprises at least a first refractory metal layer and a second refractory metal layer. The integrated barrier layer is formed using a dual-mode deposition process comprising a chemical vapor deposition (CVD) step and a cyclical deposition step. The dual-mode deposition process may be performed in a single process chamber.
1. A method for forming an integrated barrier material on a substrate, comprising:
positioning a substrate within a process chamber;
forming an integrated barrier layer on the substrate by a cyclical deposition process and a chemical vapor deposition process, wherein the integrated barrier layer comprises tungsten nitride deposited by the cyclical deposition process; and
depositing a tungsten metallization layer over the integrated barrier layer during a thermal chemical vapor deposition process, wherein the substrate is sequentially exposed to tungsten hexafluoride and ammonia during the cyclical deposition process.
2. A method for forming an integrated barrier material on a substrate, comprising:
positioning a substrate within a process chamber;
forming an integrated barrier layer on the substrate by a cyclical deposition process and a chemical vapor deposition process, wherein the integrated barrier layer comprises metallic tungsten deposited by the cyclical deposition process; and
depositing a tungsten metallization layer over the integrated barrier layer during a thermal chemical vapor deposition process, wherein the substrate is sequentially exposed to tungsten hexafluoride and a reducing gas during the cyclical deposition process.
3. The method of claim 2 , wherein the reducing gas comprises a reducing agent selected from the group consisting of silane, disilane, and diborane.