Semiconductor device and manufacturing method thereof
View Patent ↗A semiconductor device includes a plurality of chips comprising a plurality of first moisture-proof rings individually surrounding said plurality of chips, a second moisture-proof ring surrounding the entire plurality of chips, and a wire for connecting said plurality of chips to each other.
1. A semiconductor device including a plurality of chips comprising:
a plurality of first moisture-proof rings each including a wall individually surrounding said plurality of chips;
a second moisture-proof ring surrounding the entire plurality of chips; and
an interconnection connecting said plurality of chips to each other;
wherein each of the walls includes a hole penetrating the wall, and the interconnection passes through the hole.
2. The semiconductor device according to claim 1 , wherein said plurality of chips each include a pad located within the first moisture-proof ring of each of said chips.
3. A semiconductor device comprising:
a first internal circuit;
a second internal circuit adjacent to the first internal circuit;
a first moisture-proof ring including a first wall surrounding the first internal circuit;
a second moisture-proof ring including a second wall surrounding the second internal circuit;
an interconnection connecting the first internal circuit with the second internal circuit; and
a third moisture-proof ring surrounding the first internal circuit, the second internal circuit, and the wire;
wherein the first wall includes a first hole penetrating the first wall, the second wall includes a second hole penetrating the second wall, and the interconnection passes through the first hole and the second hole.
4. The semiconductor device according to claim 3 comprising:
a first pad connected to the first internal circuit;
a second pad connected to the second internal circuit;
wherein the first pad is allocated within the first moisture-proof ring, and the second pad is allocated within the second moisture-proof ring.
5. The semiconductor device according to claim 3 , wherein any one of the first to third moisture-proof rings includes two moisture-proof rings comprising an external ring surrounding an internal ring.