IP Library Granted Patent US 7,466,880
Granted Patent B2
US 7,466,880 · App. 11/779,116 · Granted Dec 16, 2008

Optical via to pass signals through a printed circuit board

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Quick Facts
Patent No.
US 7,466,880
App. No.
11/779,116
Granted
Dec 16, 2008
Kind
B2
Abstract

An optical via within a printed circuit board (PCB) to route optical signals from one level to another through the PCB. The optical signals entering the optical via from an optoelectronic device, or other source, may be routed by an optical waveguide to enter other optical vias to a destination for different purposes. The source of optical signals may be mounted to the PCB or it may be at a distance, with the optical signals being coupled to or away from the optical via by means of optical waveguides.

Claims (21)

1. A printed circuit board (PCB) comprising:

a top mounting surface;

a recessed portion having a recessed mounting surface that is substantially parallel to the top mounting surface;

an optical via extending from said recessed mounting surface to an exit port in said printed circuit board;

a first optoelectronic device mounted on said recessed mounting surface, said first optoelectronic device configured to transmit or receive an optical signal through said optical via; and

an integrated circuit (IC) mounted onto said top mounting surface such that said IC is positioned directly above said first optoelectronic device.

2. The PCB of claim 1 , further comprising: an optical waveguide spaced from and parallel with said top mounting surface, said optical waveguide comprising an angled surface adjacent said exit port, said angled surface comprising a dielectric stack for reflecting some wavelengths of light and passing other wavelengths of light impinging on it.

3. The PCB of claim 1 , further comprising a first optical waveguide coupled to one end of said optical via for conveying said optical signal to or away from said optical via.

4. The PCB of claim 1 , wherein said IC has a heat sink on a side opposite to said optoelectronic device.

5. The PCB of claim 1 , wherein a top surface of said first optoelectronic device is substantially coplanar to said top mounting surface of said PCB.

6. The PCB of claim 1 , wherein said optical via comprises:

a hole;

a cladding that is coated onto the wall of said hole; and

an optical waveguide core located within said cladding, said core having a refractive index that is higher than that of said cladding.

7. The PCB of claim 1 , wherein said optical via comprises:

a hole; and

a preformed core and cladding unit inserted into said hole, the preformed core and cladding unit operative as a light guide for propagating said optical signal.

8. The PCB of claim 1 , further comprising:

an optical waveguide spaced from and parallel with said top mounting surface, said optical waveguide comprising an angled surface adjacent said exit port, said angled surface comprising a micro mirror.

9. The PCB of claim 1 , further comprising:

an optical waveguide spaced from and parallel with said top mounting surface, said optical waveguide comprising an angled surface adjacent said exit port, said angled surface comprising a beam splitter.

Assignments (8)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 14, 2020
From: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
To: BROADCOM INTERNATIONAL PTE. LTD.
Reel/Frame 053771/0901 →
CORRECTIVE ASSIGNMENT TO CORRECT THE ERROR IN RECORDING THE MERGER PREVIOUSLY RECORDED AT REEL: 047357 FRAME: 0302. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Mar 22, 2019
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 048674/0834 →
CORRECTIVE ASSIGNMENT TO CORRECT THE EFFECTIVE DATE OF MERGER PREVIOUSLY RECORDED ON REEL 047195 FRAME 0658. ASSIGNOR(S) HEREBY CONFIRMS THE THE EFFECTIVE DATE IS 09/05/2018. Recorded Oct 29, 2018
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 047357/0302 →
MERGER Recorded Oct 4, 2018
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 047195/0658 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENTS Recorded Feb 3, 2017
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 041710/0001 →
PATENT SECURITY AGREEMENT Recorded Feb 11, 2016
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 037808/0001 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENT RIGHTS (RELEASES RF 032851-0001) Recorded Feb 2, 2016
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 037689/0001 →
PATENT SECURITY AGREEMENT Recorded May 8, 2014
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 032851/0001 →