IP Library Granted Patent US 7,345,562
Granted Patent B2
US 7,345,562 · App. 11/782,020 · Granted Mar 18, 2008

Method for making a high current low profile inductor

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Quick Facts
Patent No.
US 7,345,562
App. No.
11/782,020
Granted
Mar 18, 2008
Kind
B2
Abstract

A high current, low profile inductor includes a conductor coil surrounded by magnetic material to form an inductor body. An inductor body is formed around the inductor coil and includes a resin and a magnetic material compressed while it is dry and surrounding the inside and the outside of the coil.

Claims (14)

1. A high current low profile (IHLP) inductor comprising:

a conductive coil having an open center, an outside surface, and first and second coil ends;

a powdered magnetic conductive material comprising a plurality of powdered conductive particles;

an insulation material surrounding the powdered conductive particles and providing insulation to the powdered conductive particles;

a resin comprising resin particles;

a mixture comprising the powdered conductive particles, the insulation material, and the resin particles;

an inductor body comprising the compressed mixture while dry of the conductive particles of conductive material, the insulation material, and the resin particles;

the inductor body surrounding the conductive coil and contacting the conductive coil both inside the open center and on the outside surface of the conductive coil;

the first and second ends being outside the inductor body.

2. A high current low profile (IHLP) inductor according to claim 1 wherein the powdered conductive particles comprise powdered iron.

3. A high current low profile (IHLP) inductor according to claim 2 wherein the mixture further comprises a lubricant to facilitate the mixture to move into contact with the open center of the coil and the outside surface of the conductive coil.

4. A high current low profile (IHLP) inductor according to claim 3 wherein the mixture further comprises a filler therein.

5. A high current low profile (IHLP) inductor according to claim 1 wherein the first and second coil ends are integral with the coil.

6. A high current low profile (LHLP) inductor according to claim 1 wherein the insulation material and the resin cause the conductive particles of conductive material to have high resistance exceeding 3 mega ohms.

Assignments (4)
RELEASE OF SECURITY INTEREST Recorded Jul 17, 2019
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: VISHAY DALE ELECTRONICS, INC.; DALE ELECTRONICS, INC.; VISHAY DALE ELECTRONICS, LLC; VISHAY-DALE
Reel/Frame 049772/0898 →
RELEASE OF SECURITY INTEREST Recorded Jul 17, 2019
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: VISHAY DALE ELECTRONICS, INC.; DALE ELECTRONICS, INC.; VISHAY INTERTECHNOLOGY, INC.; SILICONIX INCORPORATED; VISHAY SPRAGUE, INC.; VISHAY TECHNO COMPONENTS, LLC; VISHAY EFI, INC.; VISHAY VITRAMON, INC.; SPRAGUE ELECTRIC COMPANY
Reel/Frame 049826/0312 →
SECURITY INTEREST Recorded Jun 12, 2019
From: VISHAY DALE ELECTRONICS, INC.; DALE ELECTRONICS, INC.; VISHAY DALE ELECTRONICS, LLC; VISHAY-DALE, INC.; VISHAY INTERTECHNOLOGY, INC.; SILICONIX INCORPORATED; VISHAY-SILICONIX, INC.; VISHAY-SILICONIX; VISHAY SPRAGUE, INC.; VISHAY EFI, INC.; SPRAGUE ELECTRIC COMPANY; VISHAY GENERAL SEMICONDUCTOR, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 049440/0876 →
SECURITY AGREEMENT Recorded Dec 10, 2015
From: VISHAY DALE ELECTRONICS, LLC
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 037261/0616 →