IP Library Granted Patent US 7,538,580
Granted Patent B2
US 7,538,580 · App. 11/782,616 · Granted May 26, 2009

Logic array devices having complex macro-cell architecture and methods facilitating use of same

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 7,538,580
App. No.
11/782,616
Granted
May 26, 2009
Kind
B2
Abstract

Logic array devices having complex macro-cell architecture and methods facilitating use of same. A semiconductor device comprising an array of logic cells and programmable metal includes gate structures that are pre-wired, where, inputs and/or outputs are available for routing in programmable metal, possibly as part of a hybrid process. The device can also include selectable, in-line inverters, which can share the input/output tracks with logic inputs. A bubble-pushing algorithm can take advantage of the selectable in-line inverters to reduce the number of inverters in a design. In some embodiments, an embedded clock line is common to a plurality of logic cells. The clock line is terminated in a clock cell, which can include test logic, so that a clock group is formed. Flexibility to power down cells, or groups of cells can be provided by power traces with programmable connections.

Claims (47)

1. A logic array comprising an array of logic cells, the logic array further comprising:

a scan chain embedded in at least some of the logic cells so as to use substantially no programmable metal; and

an embedded clock line common to a plurality of FLOP's in a plurality of logic cells, the plurality of FLOP's forming at least a part of the scan chain, the clock line terminated in a clock cell so that the clock cell and the plurality of logic cells form a clock group.

2. The logic array of claim 1 further comprising an embedded reset line common to the plurality of FLOP's and terminated in the clock cell.

3. The logic array of claim 2 wherein the clock cell further comprises test logic connected to the embedded clock line and the embedded reset line.

4. The logic array of claim 3 wherein the test logic further comprises:

test and user clock terminals;

test and user reset terminals;

a test mode terminal;

a first multiplexer connected to the test and user clock terminals, the test mode terminal, and the embedded clock line; and

a second multiplexer connected to the test and user reset terminals, the test mode terminal, and the embedded reset line.

5. The logic array of claim 1 wherein at least some of the plurality of logic cells comprise:

a plurality of NAND gates;

a plurality of multiplexers;

a FLOP; and

a high-drive inverter.

6. The logic array of claim 3 wherein at least some of the plurality of logic cells comprise:

a plurality of NAND gates;

a plurality of multiplexers;

a FLOP; and

a high-drive inverter.

7. The logic array of claim 3 wherein at least some of the plurality of logic cells further comprise random access memory connected to common select and read/write lines.

8. The logic array of claim 5 wherein at least some of the plurality of logic cells further comprise random access memory connected to common select and read/write lines.

9. The logic array of claim 6 wherein at least some of the plurality of logic cells further comprise random access memory connected to common select and read/write lines.

10. A semiconductor device comprising an array of logic cells and programmable metal adjacent to the array of logic cells, the semiconductor device further comprising:

an embedded clock line common to a plurality of logic cells, the clock line terminated in a clock cell so that the clock cell and the plurality of logic cells form a clock group;

an embedded power line common to the plurality of logic cells in the clock group;

a power trace within the programmable metal adjacent to the clock cell; and

a programmable connection between the power trace and the embedded power line wherein power has been selectively connected to gate structures within the clock group.

11. The semiconductor device of claim 10 wherein the programmable connection is a via.

12. The semiconductor device of claim 10 further comprising an embedded reset line common to the plurality of logic cells.

13. The semiconductor device of claim 11 further comprising an embedded reset line common to the plurality of logic cells.

14. The semiconductor device of claim 12 further comprising a scan chain embedded in at least some of the logic cells of the clock group so as to use substantially none of the programmable metal.

15. The semiconductor device of claim 13 further comprising a scan chain embedded in at least some of the logic cells of the clock group so as to use substantially none of the programmable metal.

16. The semiconductor device of claim 14 wherein the clock cell further comprises test logic connected to the embedded clock line and the embedded reset line.

17. The semiconductor device of claim 15 wherein the clock cell further comprises test logic connected to the embedded clock line and the embedded reset line.

18. A semiconductor chip comprising an array of logic cells disposed to receive programmable metal, the semiconductor device further comprising:

an embedded clock line common to a plurality of logic cells, the clock line terminated in a clock cell so that the clock cell and the plurality of logic cells form a clock group;

an embedded power line common to the plurality of logic cells in the clock group, the embedded power line disposed to be connected to a power trace within the programmable metal adjacent to the clock cell; wherein

a programmable connection between the power trace and the embedded power line can be used to selectively connect power to gate structures within the clock group.

19. The semiconductor chip of claim 18 wherein the programmable connection is a via.

20. The semiconductor chip of claim 18 further comprising an embedded reset line common to the plurality of logic cells.

21. The semiconductor chip of claim 19 further comprising an embedded reset line common to the plurality of logic cells.

22. The semiconductor chip of claim 20 further comprising a scan chain embedded in at least some of the logic cells of the clock group so as to use substantially none of the programmable metal.

23. The semiconductor chip of claim 21 further comprising a scan chain embedded in at least some of the logic cells of the clock group so as to use substantially none of the programmable metal.

24. The semiconductor chip of claim 22 wherein the clock cell further comprises test logic connected to the embedded clock line and the embedded reset line.

25. The semiconductor chip of claim 23 wherein the clock cell further comprises test logic connected to the embedded clock line and the embedded reset line.

Assignments (6)
RELEASE OF SECURITY INTEREST Recorded Jul 13, 2020
From: PARTNERS FOR GROWTH IV, L.P.
To: TRIAD SEMICONDUCTOR, INC.
Reel/Frame 053187/0495 →
SECURITY INTEREST Recorded Jul 10, 2020
From: TRIAD SEMICONDUCTOR, INC.
To: CP BF LENDING, LLC
Reel/Frame 053180/0379 →
RELEASE OF SECURITY INTEREST Recorded Jun 30, 2020
From: SILICON VALLEY BANK
To: TRIAD SEMICONDUCTOR, INC.
Reel/Frame 053087/0492 →
AMENDED AND RESTATED INTELLECTUAL PROPERTY SECURITY AGREEMENT Recorded Mar 16, 2016
From: TRIAD SEMICONDUCTOR, INC.
To: SILICON VALLEY BANK
Reel/Frame 038106/0300 →
SECURITY INTEREST Recorded Mar 3, 2016
From: TRIAD SEMICONDUCTOR, INC.
To: PARTNERS FOR GROWTH IV, L.P.
Reel/Frame 037885/0344 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 6, 2012
From: VIASIC, INC.
To: TRIAD SEMICONDUCTOR, INC.
Reel/Frame 029418/0552 →