IP Library Granted Patent US 7,462,833
Granted Patent B2
US 7,462,833 · App. 11/785,319 · Granted Dec 9, 2008

Multi-functional cathode packaging design for solid-state radiation detectors

Assignee: Redlen Technologies
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Quick Facts
Patent No.
US 7,462,833
App. No.
11/785,319
Granted
Dec 9, 2008
Kind
B2
Abstract

A radiation detector includes a semiconductor substrate with opposing front and rear surfaces, where a cathode electrode is located on the front surface, a plurality of anode electrodes located on the rear surface, and an electrically conductive housing is placed in electrical contact with the cathode electrode.

Claims (50)

1. A radiation detector, comprising:

a semiconductor substrate having opposing front and rear surfaces;

a cathode electrode located on the front surface of said semiconductor substrate;

a plurality of anode electrodes on the rear surface of said semiconductor substrate; and

an electrically conductive housing placed in electrical and physical contact with the cathode electrode.

2. The radiation detector of claim 1 , further comprising a solder mask with openings disposed over the plurality of anode electrodes and on sides of the semiconductor substrate.

3. The radiation detector of claim 1 , wherein the entire housing is transparent to X-ray or gamma-ray radiation.

4. The radiation detector of claim 3 , wherein the housing is a unitary housing.

5. The radiation detector of claim 1 , wherein the housing is between about 50 and about 100 microns thick.

6. The radiation detector of claim 1 , wherein the housing shields the detector from electro-magnetic fields.

7. The radiation detector of claim 1 , wherein the housing does not oxidize in ambient air.

8. The radiation detector of claim 1 , wherein the housing comprises stainless steel, brass, a NiCo alloy, a NiFe alloy, a NiFeCo alloy, a NiFeMo alloy or a NiFeCuMo alloy.

9. The radiation detector of claim 1 , wherein the housing comprises a Mu-metal.

10. The radiation detector of claim 1 , wherein at least one side of the housing extends at least partially over a side of the substrate.

11. The radiation detector of claim 10 , further comprising an air gap located between said at least one side of housing and the side of the substrate.

12. The radiation detector of claim 10 , further comprising an insulator material located between said at least one side of housing and the side of the substrate.

13. The radiation detector of claim 1 , further comprising an electrically conductive adhesive between the housing and the cathode electrode.

14. The radiation detector of claim 13 , wherein the electrically conductive adhesive comprises an epoxy adhesive.

15. The radiation detector of claim 1 , wherein the detector contains an array of pixels on a single semiconductor substrate.

16. A method of making a radiation detector with a housing, comprising:

providing the radiation detector comprising:

a semiconductor substrate having opposing front and rear surfaces;

a cathode electrode located on the front surface of said semiconductor substrate; and

a plurality of anode electrodes on the rear surface of said semiconductor substrate;

providing a separately formed electrically conductive housing, wherein the entire housing is transparent to X-ray or gamma-ray radiation; and

attaching the housing to the cathode electrode such that the housing and the cathode electrode are in electrical contact.

17. The method of claim 16 , wherein at least one side of the housing extends at least partially over a side of the substrate.

18. The method of claim 17 , further comprising an air gap located between said at least one side of housing and the side of the substrate.

19. The method of claim 17 , further comprising an electrically insulating material located between said at least one side of housing and the side of the substrate.

20. The method of claim 16 , wherein the housing comprises stainless steel, brass, a NiCo alloy, a NiFe alloy, a NiFeCo alloy, a NiFeMo alloy or a NiFeCuMo alloy.

21. The method of claim 16 , wherein the housing comprises a Mu-metal.

22. The method of claim 16 , wherein the housing and the cathode electrode are attached to each other via an electrically conductive adhesive.

23. The method of claim 22 , further comprising applying a layer of the electrically conductive adhesive comprising an electrically conductive epoxy on an inner surface of the housing before the step of attaching the housing to the cathode electrode.

24. A radiation detector, comprising:

a semiconductor substrate having opposing front and rear surfaces;

a cathode electrode located on the front surface of said semiconductor substrate;

a plurality of anode electrodes on the rear surface of said semiconductor substrate; and

an electrically conductive housing placed in electrical contact with the cathode electrode, wherein the entire housing is transparent to X-ray or gamma-ray radiation.

25. The radiation detector of claim 24 , further comprising a solder mask with openings disposed over the plurality of anode electrodes and on sides of the semiconductor substrate.

26. The radiation detector of claim 24 , wherein the housing is between about 50 and about 100 microns thick.

27. The radiation detector of claim 24 , wherein the housing shields the detector from electro-magnetic fields.

28. The radiation detector of claim 24 , wherein the housing does not oxidize in ambient air.

29. The radiation detector of claim 24 , wherein the housing comprises stainless steel, brass, a NiCo alloy, a NiFe alloy, a NiFeCo alloy, a NiFeMo alloy or a NiFeCuMo alloy.

30. The radiation detector of claim 24 , wherein the housing comprises a Mu-metal.

31. The radiation detector of claim 24 , wherein at least one side of the housing extends at least partially over a side of the substrate.

32. The radiation detector of claim 31 , further comprising an air gap located between said at least one side of housing and the side of the substrate.

33. The radiation detector of claim 31 , further comprising an insulator material located between said at least one side of housing and the side of the substrate.

34. The radiation detector of claim 24 , further comprising an electrically conductive adhesive between the housing and the cathode electrode.

35. The radiation detector of claim 34 , wherein the electrically conductive adhesive comprises an epoxy adhesive.

36. The radiation detector of claim 24 , wherein the detector contains an array of pixels on a single semiconductor substrate and the housing is in physical contact with the cathode electrode.

Assignments (3)
RELEASE OF SECURITY INTEREST Recorded Mar 30, 2023
From: THE BUSINESS DEVELOPMENT BANK OF CANADA
To: REDLEN TECHNOLOGIES INC.
Reel/Frame 063170/0719 →
SECURITY INTEREST Recorded Apr 15, 2020
From: REDLEN TECHNOLOGIES INC.
To: BUSINESS DEVELOPMENT BANK OF CANADA
Reel/Frame 052407/0903 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 17, 2007
From: CHEN, HENRY; LU, PINGHE; BROUGHAM, RAY; AWADALLA, SALAH; MACDONALD, ANDREW; BINDLEY, GLENN
To: REDLEN TECHNOLOGIES
Reel/Frame 019273/0628 →
Continuity (1)
Related Publication 20080258066A1 · Oct 23, 2008