IP Library Granted Patent US 7,795,552
Granted Patent B2
US 7,795,552 · App. 11/802,315 · Granted Sep 14, 2010

Contact piece member, contactor and contact method

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Quick Facts
Patent No.
US 7,795,552
App. No.
11/802,315
Granted
Sep 14, 2010
Kind
B2
Abstract

In a contactor contact piece members can be arranged at a fine pitch, and a contact can be made surely by a small contact pressure. The contact piece members electrically connect an electronic part to an external circuit. The contact piece member is formed of an electrically conductive material in a generally spherical shape. A molecular density of a central part of the contact piece member is lower than a molecular density of a part near a surface. The electrically conductive material may include at least one of an electrically conductive fine particle, an electrically conductive fiber and an electrically conductive filler.

Claims (6)

1. A contact piece member formed of an electrically conductive polymer material and having a generally spherical shape in a normal state and being elastically deformable, the contact piece member comprising:

a central part formed of the electrically conductive polymer material and having a first molecular density; and

a peripheral part surrounding the central part, the peripheral part formed of the electrically conductive polymer material and having a second molecular density,

wherein the first molecular density is lower than the second molecular density, and a value of the first molecular density is not zero, and

wherein a surface of said contact piece member is a solid film, and an inside of said contact piece member is in a liquid state or a gel state.

2. The contact piece member as claimed in claim 1 , including at least one of an electrically conductive fine particle, an electrically conductive fiber and an electrically conductive filler.

Assignments (4)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 27, 2015
From: FUJITSU SEMICONDUCTOR LIMITED
To: SOCIONEXT INC.
Reel/Frame 035508/0469 →
CHANGE OF NAME Recorded Sep 27, 2010
From: FUJITSU MICROELECTRONICS LIMITED
To: FUJITSU SEMICONDUCTOR LIMITED
Reel/Frame 025046/0478 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 9, 2008
From: FUJITSU LIMITED
To: FUJITSU MICROELECTRONICS LIMITED
Reel/Frame 021976/0089 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 22, 2007
From: MARUYAMA, SHIGEYUKI; NISHINO, TORU
To: FUJITSU LIMITED
Reel/Frame 019388/0270 →