IP Library Granted Patent US 7,614,787
Granted Patent B2
US 7,614,787 · App. 11/821,829 · Granted Nov 10, 2009

Marking apparatus used in a process for producing multi-layered printed circuit board

Assignee: Adtec Engineering Co., Ltd.
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Quick Facts
Patent No.
US 7,614,787
App. No.
11/821,829
Granted
Nov 10, 2009
Kind
B2
Abstract

X-rays are irradiated at the board 5 from the X-ray generator 11, the image of the standard marks 50, 51 are projected on the fluorescence screen 12, the resulted image is photographed simultaneously by one shot of the visible light CCD camera 13 and finally processed by the control device 9 to simultaneously determine the position of the standard marks 50 and 51. the alignment marks depicted on the photo masks 24 and 25 are imprinted on the dry film resist layers 55 respectively based on the positions of the standard marks 50 and 51 by irradiating X-rays through the sets of mirrors 22, 23 on the dry film resist layers 55.

Claims (42)

1. A marking apparatus used in a process for producing multi-layered printed circuit board having a core board and a plurality of vertically separated isolation layers and a plurality of vertically separated conductive layers at both front and rear sides of the core board, the apparatus comprising;

at least one standard mark formed on a front side of the core board and at least one standard mark formed on a rear side of the core board, wherein said at least one standard mark on the front side of the core board is different from said at least one standard mark formed on the rear side of the core board in at least one of size and shape and each of the at least one standard marks is disposed in a certain area,

a position detecting device that simultaneously detects the positions in a plane direction of the standard marks by simultaneously photographing the standard marks in the certain area using X-rays irradiating toward thickness direction of the multilayered printed circuit board,

a marking device for making a first new mark on a surface of the multi-layered printed circuit board based on the detected position of said at least one standard mark disposed on the front side of the core board, and

a marking device for making a second new mark on a surface of the multi-layered printed circuit board based on the detected position of said at least one standard mark disposed on the rear side of the core board.

2. The marking apparatus of claim 1 wherein,

said at least two standard marks are disposed with a gap therebetween in a plane direction in a predetermined area.

3. The marking apparatus of claim 2 wherein,

said gap is more than tolerance in a plane direction when making the layer on which the standard mark is formed.

4. The marking apparatus of claim 1 wherein,

at least one of said two standard marks has a hole,

other mark is disposed in said hole with a gap in a plane direction.

5. The marking apparatus of claim 4 wherein,

said gap is more than tolerance in a plane direction when making the layer on which the standard mark is formed.

6. The marking apparatus of claim 4 wherein,

said position detecting device comprises;

a X-ray generator disposed at the one side of the multi-layered printed circuit board for irradiating X-rays in the thickness direction of the circuit board,

a fluorescence screen disposed at another side of the multi-layered printed circuit board for detecting said X-rays penetrating said circuit board, converting the X-rays into visible rays and projecting the visible images of the standard marks on the surface thereof,

a photographing device for photographing said images of the standard marks projected on the fluorescence screen.

7. The marking apparatus of claim 1 wherein,

at least part of said two standard marks are overlapped in a plane direction,

said position detecting device detects the positions by using the shade of the photographed images of the standard marks.

8. The marking apparatus of claim 1 wherein,

said position detecting device comprises;

a X-ray generator disposed at the one side of the multi-layered printed circuit board for irradiating X-rays in the thickness direction of the circuit board,

a fluorescence screen disposed at another side of the multi-layered printed circuit board for detecting said X-rays penetrating said circuit board, converting the X-rays into visible rays and projecting the visible images of the standard marks on the surface thereof,

a photographing device for photographing said images of the standard marks projected on the fluorescence screen.

9. A marking apparatus used in a process for producing multi-layered printed circuit board having a core board and a plurality of vertically separated isolation layers and a plurality of vertically separated conductive layers at both front and rear sides of the core board, the apparatus comprising;

at least one standard mark formed on a front side of the core board and at least one standard mark formed on a rear side of the core board, at least parts of each of said standard marks are overlapped in a plane direction;

a position detecting device that simultaneously detects the positions in a plane direction of said standard marks by simultaneously imaging the standard marks using X-rays irradiating toward a thickness direction of the multilayered printed circuit board and by using shaded portions of the images of the standard marks;

a marking device for making a new mark on a surface of the multilayered printed circuit board based on the detected position of one of said standard marks; and

a marking device for making another new mark on a surface of the multi-layered printed circuit board based on the detected position of another of said standard marks.

10. A marking apparatus used in a process for producing a multi-layered printed circuit board having a core board that includes at least one standard mark formed on a front side of the core board and at least one standard mark formed on a rear side of the core board and a plurality of vertically separated isolation layers and a plurality of vertically separated conductive layers disposed on both front and rear sides of the core board, said at least one standard mark on the front side of the core board being different from said at least one standard mark formed on the rear side of the core board in at least one of size and shape, the apparatus comprising:

a position detecting device that detects positions in a plane direction of each of the at least one standard marks;

a marking device for making at least one new mark on a surface of a next layer of the multilayered printed circuit board based on the detected position of the at least one standard mark disposed on the front side of the core board, the detected position of the at least one standard mark disposed on the rear side of the core board, or the detected position of both of said standard marks relative to each other.

11. The apparatus as recited in claim 10 , wherein the surface of the multilayered printed circuit board is a dry-film resist layer or a liquid resist layer.

12. The apparatus as recited in claim 11 , wherein the surface of the multilayered printed circuit board is on the front side of core board or on the rear side of the core board or on both sides of the core board.

13. The apparatus as recited in claim 11 , the marking device further including an ultraviolet light source, at least one mirror, and a corresponding photo mask for each mirror, said photo mask including at least one alignment mark that is selectively positionable to mask a portion of the dry-film or liquid resist layer.

14. The apparatus as recited in claim 13 , the at least one new mark being located at said masked portion of the dry-film resist layer.

15. The apparatus as recited in claim 10 , wherein the marking device includes a selectively positionable mirror for each side of the next layer of the multilayered printed circuit board to be marked with a new alignment mark.

16. The apparatus as recited in claim 10 further comprising a controller that is adapted to determine positions in a plane direction of each of the at least one standard marks, to control positioning of the marking device and of the at least one new mark with respect to the multilayered printed circuit board.

17. The apparatus as recited in claim 16 , wherein the controller is adapted to control positioning of the marking device and of the at least one new mark by positioning at least one of said at least one mirrors, said corresponding photo masks, and the multi-layered printed circuit board.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 20, 2007
From: NAKAGAWA, WATARU
To: ADTEC ENGINEERING CO., LTD.
Reel/Frame 019856/0146 →
Priority Claims (1)
JP 2006-188972 · Jul 10, 2006 · national
Continuity (1)
Related Publication 20080013679A1 · Jan 17, 2008