Microelectronic package element and method of fabricating thereof
View Patent ↗Microelectronic package elements and packages having dielectric layers and methods of fabricating such elements packages are disclosed. The elements and packages may advantageously be used in microelectronic assemblies having high routing density.
1. A method making a package element having a top face and a bottom face remote from the top face, comprising the steps of:
(i) deforming a metal sheet to form a plurality of hollow contacts, the hollow contacts including upwardly-facing first contacts exposed at the top face, and a plurality of downwardly-facing second contacts exposed at the bottom face connected to the first contacts, at least some of the first and second contacts being electrically isolated from others of the first and second contacts; and
(ii) applying a dielectric material into spaces between at least some of the first and second contacts, the first contacts being exposed at the top face and the second contacts being exposed at the bottom face.
2. The method of claim 1 wherein step (i) includes stamping the metal sheet to form the plurality of hollow contacts.
3. The method of claim 1 wherein the metal sheet is deformed between a first die and a second die to form the plurality of hollow contacts.
4. The method of claim 1 wherein further including photolithographically defining a mask layer overlying the deformed metal sheet and etching the deformed metal sheet in accordance with the mask layer to electrically isolate the at least some first and second contacts from the others of the first and second contacts.
5. The method of claim 1 wherein the dielectric material is applied by flowing through at least one of a stencil or a screen.
6. The method of claim 1 wherein the dielectric material is applied with a spin-on process.
7. The method of claim 1 wherein the dielectric material is applied with an injection molding process.
8. The method of claim 1 wherein the dielectric material is applied by a laminating a dielectric sheet onto at least one of the top face or bottom face.
9. The method of claim 1 wherein the metal sheet consists essentially of copper.
10. The method of claim 1 wherein the dielectric material includes epoxy.
11. A method of packaging a microelectronic element, comprising the steps of:
(a) forming a package element having a top face and a bottom face remote from the top face, the package element being formed by (i) deforming a metal sheet to form a plurality of hollow contacts, the hollow contacts including upwardly-facing first contacts exposed at the top face, and a plurality of downwardly-facing second contacts exposed at the bottom face connected to the first contacts, at least some of the first and second contacts being electrically isolated from others of the first and second contacts; and (ii) applying a dielectric material into spaces between at least some of the first and second contacts, the first contacts being exposed at the top face and the second contacts being exposed at the bottom face, and
(b) mounting a microelectronic element to the top face of the package element and electrically interconnecting the microelectronic element to at least one of the first contacts or the second contacts.
12. The method of claim 11 wherein step (a) includes stamping the metal sheet to form the plurality of hollow contacts.
13. The method of claim 11 wherein step (a) includes deforming the metal sheet between a first die and a second die to form the plurality of hollow contacts.
14. The method of claim 11 , wherein step (a) further includes photolithographically defining a mask layer overlying the deformed metal sheet and etching the deformed metal sheet in accordance with the mask layer to electrically isolate the at least some first and second contacts from the others of the first and second contacts.
15. The method of claim 11 wherein the dielectric material is applied by flowing a fluid dielectric through at least one of a stencil or a screen.
16. The method of claim 11 wherein the dielectric material is applied with a spin-on process.
17. The method of claim 11 wherein the dielectric material is applied with an injection molding process.
18. The method of claim 11 wherein the dielectric material is applied by laminating dielectric sheet material onto at least one of the top face or bottom face.
19. The method of claim 11 wherein the metal sheet consists essentially of copper.
20. The method of claim 11 wherein the dielectric material includes epoxy.