INTERCONNECT STRUCTURE
An interconnect structure includes an insulative web having a first surface and a second surface; a logic device secured to the second surface of the insulative web; a frame panel assembly including a frame base having a first surface and a second surface, a first frame insulative layer disposed between the frame base first surface and the insulative web second surface, an aperture extending through the frame base and first frame insulative layer, wherein at least a portion of the logic device is disposed within the aperture, and a first frame connector disposed between a first electrically conductive layer located on the frame base first surface, and a second electrically conductive layer located on a surface of the first frame insulative layer; a device connector disposed between an I/O contact on a surface of the logic device and a third electrical conductor located on a surface of the insulative web; and an insulative layer connector that is disposed between the third electrical conductor located on a surface of the insulative web and the second electrically conductive layer located on a surface of the first frame insulative layer.
1 . An interconnect structure, comprising:
an insulative web having a first surface and a second surface;
a logic device secured to the second surface of the insulative web;
a frame assembly supporting the insulative web and comprising:
a frame base having a first surface, a second surface, and an inward facing surface defining a frame aperture, the frame aperture extending through the frame base from the frame base first surface to the frame base second surface, wherein at least a portion of the logic device is disposed within the aperture; and
a first conductive layer located on the frame base first surface;
a device connector operable to allow the logic device to communicate therethrough to the first conductive layer.
2 . The interconnect structure as defined in claim 1 , wherein the insulative web is a polymer film.
3 . The interconnect structure as defined in claim 2 , wherein the insulative web comprises one or more material selected from the group consisting of a polyimide, polyetherimide, benzocyclobutene, bismaleimide triazine resin, epoxy, and silicone.
4 . The interconnect structure as defined in claim 1 , wherein the frame base is metal, a coated metal, or a ceramic structure.
5 . The interconnect structure as defined in claim 1 , wherein the frame base comprises a polymeric material.
6 . The interconnect structure as defined in claim 1 , further comprising a frame adhesive layer securing the frame base first surface to a first frame insulative layer.
7 . The interconnect structure as defined in claim 1 , wherein the frame assembly further comprises a first frame insulative layer disposed between the frame base first surface and the insulative web.
8 . The interconnect structure as defined in claim 7 , further comprising an insulative layer connector that is disposed between a conductive layer located on a surface of the insulative web and a conductive layer located on a surface of the first frame insulative layer.
9 . The interconnect structure as defined in claim 1 , further comprising an insulative web adhesive layer.
10 . The interconnect structure as defined in claim 1 , wherein the interconnect structure has at least one surface defining a via that extends through the insulative web to a logic device I/O contact, and wherein a device connector located in the via comprises electrically conductive material.
11 . The interconnect structure as defined in claim 1 , wherein the first frame insulative layer has a first surface and a second surface, wherein the interconnect structure has at least one surface defining a via that extends from the first surface of the insulative web to the second electrically conductive layer disposed on the first surface of the first frame insulative layer, and wherein the insulative layer connector comprises:
electrically conductive material disposed within at least a portion of the via, and the electrically conductive material extends through the via to the second electrically conductive layer.
12 . The interconnect structure as defined in claim 1 , wherein the first frame insulative layer has a first surface and a second surface, wherein the interconnect structure has at least one surface defining a via that extends from the first surface of the first frame insulative layer to the first electrically conductive layer disposed on the frame base first surface, and wherein the frame connector comprises:
electrically conductive material disposed within at least a portion of the via, and the electrically conductive material extends through the via to the first electrically conductive layer.
13 . The interconnect structure as defined in claim 1 , further comprising encapsulation material disposed within the frame aperture, wherein the encapsulation material at least partially surrounds the logic device.
14 . The interconnect structure as defined in claim 13 , further comprising encapsulation material disposed within the frame aperture, wherein the encapsulation material fully surrounds the logic device.
15 . The interconnect structure as defined in claim 13 , wherein the encapsulation material comprises one or more of a polyamide, polyacrylate, polyurethane, polypropylene, polysulfone, polytetrafluoroethylene, epoxy, benzocyclobutene, polyimide, polyetherimide, polycarbonate, or silicone.
16 . The interconnect structure as defined in claim 1 , wherein the conductive layer is a ground plane or a power plane.
17 . The interconnect structure as defined in claim 1 , wherein the conductive layer comprises one or more material selected from the group consisting of Al, Ag, Au, Cu, Ni, Pb, Sn, and Ti.
18 . The interconnect structure as defined in claim 1 , wherein the insulative web and the frame assembly have surfaces that define a plurality of apertures extending therethrough; and optionally comprising an I/O pin disposed within each orifice.
19 . The interconnect structure as defined in claim 1 , further comprising a passivation layer disposed on an outward facing surface of an outermost interconnection layer.
20 . The interconnect structure as defined in claim 1 , wherein the first frame insulative layer comprises a first surface and a second surface, and the frame assembly further comprises:
a second frame insulative layer having a first surface and a second surface, wherein the first surface of the first frame insulative layer is secured to the second surface of the second frame insulative layer; and
a second frame connector between the second electrically conductive layer located on the first frame insulative layer and a fourth electrical conductor located on the second frame insulative layer.
21 . The interconnect structure as defined in claim 20 , further comprising a frame connector communicating with the logic device through a conductive layer supported by the insulative web.
22 . The interconnect structure as defined in claim 1 , further comprising a second insulative web secured to the first insulative web and supporting at least one conductive layer.
23 . An article comprising:
a frame assembly comprising:
a frame base having a first surface and a second surface, and the frame base being conductive;
a first frame insulative layer disposed on the frame base first surface;
a frame aperture extending through the frame base;
a frame conductive layer disposed on the first frame insulative layer; and
a frame connector supported by the frame base in communication with at least a portion of the frame conductive layer;
an insulative web having a first surface and a second surface;
an insulative web conductive layer supported by the insulative web;
a logic device supported by the insulative web and disposed within the frame aperture;
a device connector communicating with the insulative web conductive layer, a frame connector communicating with the frame conductive layer and the insulative web conductive layer.
24 . The article as defined in claim 23 , wherein the logic device is an optical device, and wherein the frame connector and device connector are optically transmissive, and the frame conductive layer and the insulative web conductive layer comprise waveguides.
25 . An electronic component, comprising:
a frame supporting a web and a logic device secured to the web, and
optical or electronic circuitry supported by the frame, and the supported optical or electronic circuitry communicates with the logic device.
26 . The component as defined in claim 25 , wherein the electronic circuitry comprises one or more passive components.
27 . The component as defined in claim 25 , further comprising an electrical device connector through which the logic device communicates with the electronic circuitry.
28 . The component as defined in claim 25 , further comprising an optical device connector through which the logic device communicates with the optical circuitry.
29 . The component as defined in claim 28 , wherein the optical connector is an optical fiber or an optical waveguide.
30 . The component as defined in claim 27 , wherein the frame has an outer surface that defines a peripheral edge and the optical or electronic circuitry comprises an I/O port that is disposed on the peripheral edge to allow the logic device to communicate therethrough.
31 . The component as defined in claim 30 , wherein the frame defines an aperture through a body of the frame through which a device connector extends.
32 . The component as defined in claim 30 , wherein the frame defines an open-sided channel through a body of the frame through which a device connector extends.
33 . The component as defined in claim 25 , wherein the frame has an inner surface defining an aperture, and the web is supported within the aperture, wherein the frame supplies structural rigidity to the component.
34 . The component as defined in claim 25 , wherein the frame is electrically conductive, and further comprising a dielectric layer disposed on a surface of the frame and adjacent to the electronic circuitry.