Top layers of metal for high performance IC's
View Patent ↗A method of closely interconnecting integrated circuits contained within a semiconductor wafer to electrical circuits surrounding the semiconductor wafer. Electrical interconnects are held to a minimum in length by making efficient use of polyimide or polymer as an inter-metal dielectric thus enabling the integration of very small integrated circuits within a larger circuit environment at a minimum cost in electrical circuit performance.
1. An integrated circuit chip comprising:
a silicon substrate;
multiple devices in and on said silicon substrate, wherein one of said multiple devices comprises a transistor;
a first dielectric layer over said silicon substrate;
a first metallization structure over said first dielectric layer, wherein said first metallization structure is connected to said multiple devices, and wherein said first metallization structure comprises a first metal layer and a second metal layer over said first metal layer;
a second dielectric layer between said first and second metal layers;
a passivation layer over said first metallization structure and over said first and second dielectric layers, a first opening in said passivation layer exposing a first pad of said first metallization structure, and a second opening in said passivation layer exposing a second pad of said first metallization structure, wherein said first and second pads are separate from each other, and wherein said passivation layer comprises a topmost oxide layer of said integrated circuit chip and a topmost nitride layer of said integrated circuit chip, wherein said topmost nitride layer is over said topmost oxide layer; and
a second metallization structure over said passivation layer and over said first and second pads, a signal going up through said first opening, continuing over a distance in a direction of a horizontal plane of said second metallization structure, and descending from said second metallization structure down to said second pad by passing through said second opening.
2. The integrated circuit chip of claim 1 , wherein said second metallization structure comprises electroplated copper.
3. The integrated circuit chip of claim 1 , wherein said second metallization structure comprises aluminum.
4. The integrated circuit chip of claim 1 , wherein said second metallization structure comprises nickel.
5. The integrated circuit chip of claim 1 , wherein said first metallization structure comprises electroplated copper.
6. The integrated circuit chip of claim 1 , wherein said first metallization structure comprises aluminum.
7. The integrated circuit chip of claim 1 further comprising a polymer layer on said passivation layer, wherein a third opening in said polymer layer is over said first pad, and a fourth opening in said polymer layer is over said second pad, and wherein said second metallization structure is over said polymer layer.
8. The integrated circuit chip of claim 7 , wherein said polymer layer has a thickness between 2 and 30 microns.
9. The integrated circuit chip of claim 7 , wherein said polymer layer comprises polyimide.
10. The integrated circuit chip of claim 7 , wherein said polymer layer comprises benzocyclobutene (BCB).
11. An integrated circuit chip comprising:
a silicon substrate;
multiple devices in and on said silicon substrate;
a first dielectric layer over said silicon substrate;
a first metallization structure over said first dielectric layer, wherein said first metallization structure is connected to said multiple devices, and wherein said first metallization structure comprises a first metal layer and a second metal layer over said first metal layer;
a second dielectric layer between said first and second metal layers;
a passivation layer over said first metallization structure and over said first and second dielectric layers, a first opening in said passivation layer exposing a first pad of said first metallization structure, and a second opening in said passivation layer exposing a second pad of said first metallization structure, wherein said first and second pads are separated from each other;
a polymer layer over said passivation layer, a third opening in said polymer layer exposing said first pad, and a fourth opening in said polymer layer exposing said second pad, wherein said polymer layer has a thickness of greater than 2 microns; and
a second metallization structure over said polymer layer and over said first and second pads, a signal going up through said first and third openings, continuing over a distance in a direction of a horizontal plane of said second metallization structure, and descending from said second metallization structure down to said second pad by passing through said fourth and second openings.
12. The integrated circuit chip of claim 11 , wherein said thickness is between 2 and 30 microns.
13. The integrated circuit chip of claim 11 , wherein said polymer layer comprises polyimide.
14. The integrated circuit chip of claim 11 , wherein said polymer layer comprises benzocyclobutene (BCB).
15. The integrated circuit chip of claim 11 , wherein said second metallization structure comprises electroplated copper.
16. The integrated circuit chip of claim 11 , wherein said second metallization structure comprises aluminum.
17. The integrated circuit chip of claim 11 , wherein said second metallization structure comprises nickel.
18. The integrated circuit chip of claim 11 , wherein said first metallization structure comprises electroplated copper.
19. The integrated circuit chip of claim 11 , wherein said first metallization structure comprises aluminum.
20. The integrated circuit chip of claim 11 , wherein said passivation layer comprises a topmost nitride layer of said integrated circuit chip and a topmost oxide layer of said integrated circuit chip.