IP Library › Assignment 023119/0387
Patent Assignment
Reel/Frame 023119/0387

Assignment of Assignor's Interest

Recorded: 2009-08-20 Pages: 11
Assignor
LIN, MOU-SHIUNG, DR.
Executed: 2009-07-28
Assignee
MEGICA CORPORATION
47 PARK 2ND ROAD, SUITE 301, SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, ROC, TAIWAN
Covered Properties (81)
Wafer Scale Packaging Scheme
Patent: 6,103,552 →
Application: 09/131,429 →
Top Layers of Metal for High Performance Ic's
Application: 09/216,791 →
Intergrated Circuit Has Common Function Knows Good Intergrated Circuit Die with Multiple Selectable Functions
Patent: 6,356,958 →
Application: 09/246,303 →
Strain Release Contact System for Integrated Circuits
Patent: 6,159,773 →
Application: 09/249,252 →
Top Layers of Metal for High Performance Ic's
Patent: 6,383,916 →
Application: 09/251,183 →
High Performance Sub-System Design and Assembly
Patent: 6,180,426 →
Application: 09/258,911 →
Software Programmable Multiple Function Integrated Circuit Module
Patent: 6,555,398 →
Application: 09/422,174 →
Wafer Scale Packaging Scheme
Patent: 6,486,563 →
Application: 09/619,017 →
Strain release contact system for integrated circuits
Patent: 6,351,035 →
Application: 09/727,869 →
Publication: US 2001/0000152
High performance sub-system design and assembly
Patent: 6,303,996 →
Application: 09/729,152 →
Publication: US 2001/0000013
Top Layers of Metal for High Performance Ic's
Patent: 6,657,310 →
Application: 09/972,639 →
Publication: US 2002/0048930
Top Layers of Metal for High Performance Ic's
Patent: 6,620,728 →
Application: 10/058,259 →
Publication: US 2002/0068441
Software Programmable Multiple Function Integrated Circuit Module
Patent: 7,360,005 →
Application: 10/385,953 →
Publication: US 2003/0172364
Top Layers of Metal for High Performance Ic's
Patent: 6,965,165 →
Application: 10/389,543 →
Publication: US 2003/0170934
Top Layers of Metal for High Performance Ic's
Patent: 7,294,870 →
Application: 11/121,477 →
Publication: US 2005/0200023
Top Layers of Metal for High Performance Ic's
Patent: 7,329,954 →
Application: 11/130,917 →
Publication: US 2005/0245067
Top Layers of Metal for High Performance Ic's
Patent: 7,372,155 →
Application: 11/131,481 →
Publication: US 2005/0208757
Top Layers of Metal for High Performance Ic's
Patent: 7,384,864 →
Application: 11/145,468 →
Publication: US 2005/0260849
Top Layers of Metal for High Performance Ic's
Patent: 7,422,976 →
Application: 11/149,092 →
Publication: US 2005/0266612
Top Layers of Metal for High Performance Ic's
Patent: 7,294,871 →
Application: 11/230,004 →
Publication: US 2006/0012049
Top Layers of Metal for High Performance Ic's
Patent: 7,372,085 →
Application: 11/230,101 →
Publication: US 2006/0043594
Top Layers of Metal for High Performance Ic's
Patent: 7,368,376 →
Application: 11/230,102 →
Publication: US 2006/0051955
Top Layers of Metal for High Performance Ic's
Patent: 7,385,291 →
Application: 11/829,105 →
Publication: US 2007/0262458
Top layers of metal for high performance IC's
Application: 11/829,106 →
Publication: US 2007/0262459
Top layers of metal for high performance IC's
Application: 11/829,107 →
Publication: US 2007/0262460
Top Layers of Metal for High Performance Ic's
Patent: 7,358,610 →
Application: 11/829,108 →
Publication: US 2007/0262455
Top Layers of Metal for High Performance Ic's
Patent: 7,999,384 →
Application: 11/829,109 →
Publication: US 2007/0262456
Top Layers of Metal for High Performance Ic's
Patent: 8,531,038 →
Application: 11/829,110 →
Publication: US 2007/0262457
Top layers of metal for high performance IC's
Application: 11/833,225 →
Publication: US 2007/0267714
Top Layers of Metal for High Performance Ic's
Application: 11/839,550 →
Publication: US 2007/0273032
Top layers of metal for high performance IC's
Application: 11/839,551 →
Publication: US 2007/0273033
Top layers of metal for high performance IC's
Application: 11/839,552 →
Publication: US 2007/0273034
Top Layers of Metal for High Performance Ic's
Patent: 7,884,479 →
Application: 11/839,554 →
Publication: US 2007/0273035
Top layers of metal for high performance IC's
Application: 11/839,556 →
Publication: US 2007/0273036
Top layers of metal for high performance IC's
Application: 11/839,557 →
Publication: US 2007/0273037
Top Layers of Metal for High Performance Ic's
Patent: 7,442,969 →
Application: 11/839,558 →
Publication: US 2007/0273038
Top Layers of Metal for High Performance Ic's
Patent: 7,397,135 →
Application: 11/839,559 →
Publication: US 2007/0273039
Top layers of metal for high performance IC's
Application: 11/839,560 →
Publication: US 2007/0273040
Top layers of metal for high performance IC's
Application: 11/839,561 →
Publication: US 2007/0273041
Top layers of metal for high performance IC's
Application: 11/840,230 →
Publication: US 2007/0278688
Top layers of metal for high performance IC's
Application: 11/840,231 →
Publication: US 2007/0278684
Top layers of metal for high performance IC's
Application: 11/840,232 →
Publication: US 2007/0278685
Top layers of metal for high performance IC's
Application: 11/840,233 →
Publication: US 2007/0278689
Top layers of metal for high performance IC's
Application: 11/840,234 →
Publication: US 2007/0278690
Top layers of metal for high performance IC's
Application: 11/840,235 →
Publication: US 2007/0281467
Top layers of metal for high performance IC's
Application: 11/840,236 →
Publication: US 2007/0281468
Top layers of metal for high performance IC's
Application: 11/840,237 →
Publication: US 2007/0281463
Top layers of metal for high performance IC's
Application: 11/840,238 →
Publication: US 2007/0278686
Top Layers of Metal for High Performance Ic's
Patent: 7,465,975 →
Application: 11/840,239 →
Publication: US 2007/0278687
Top layers of metal for high performance IC's
Application: 11/840,241 →
Publication: US 2007/0281458
Top Layers of Metal for High Performance Ic's
Patent: 7,425,764 →
Application: 11/840,242 →
Publication: US 2007/0278679
Top layers of metal for high performance IC's
Application: 11/840,243 →
Publication: US 2007/0278691
Top Layers of Metal for High Performance Ic's
Patent: 8,471,384 →
Application: 11/842,153 →
Publication: US 2007/0284750
Top layers of metal for high performance IC's
Application: 11/842,158 →
Publication: US 2007/0284751
Top layers of metal for high performance IC's
Application: 11/842,159 →
Publication: US 2007/0284753
Top Layers of Metal for High Performance Ic's
Patent: 7,482,693 →
Application: 11/842,160 →
Publication: US 2007/0284739
Top layers of metal for high performance IC's
Application: 11/842,161 →
Publication: US 2007/0284752
Top Layers of Metal for High Performance Ic's
Application: 11/845,109 →
Publication: US 2007/0290348
Top layers of metal for high performance IC's
Application: 11/845,110 →
Publication: US 2007/0290349
Top layers of metal for high performance IC's
Application: 11/845,111 →
Publication: US 2007/0290350
Top Layers of Metal for High Performance Ic's
Application: 11/845,113 →
Publication: US 2007/0290351
Top Layers of Metal for High Performance Ic's
Patent: 7,385,292 →
Application: 11/845,115 →
Publication: US 2007/0290352
Top Layers of Metal for High Performance Ic's
Patent: 7,388,292 →
Application: 11/845,116 →
Publication: US 2007/0290353
Top layers of metal for high performance IC's
Application: 11/845,122 →
Publication: US 2007/0290354
Top Layers of Metal for High Performance Ic's
Patent: 8,415,800 →
Application: 11/845,123 →
Publication: US 2007/0290368
Top layers of metal for high performance IC's
Application: 11/845,759 →
Publication: US 2007/0290355
Top layers of metal for high performance IC's
Application: 11/845,764 →
Publication: US 2007/0290356
Top Layers of Metal for High Performance Ic's
Patent: 7,382,058 →
Application: 11/845,766 →
Publication: US 2007/0290357
Top layers of metal for high performance IC's
Application: 11/845,771 →
Publication: US 2007/0290358
Top layers of metal for high performance IC's
Application: 11/845,773 →
Publication: US 2007/0293036
Top Layers of Metal for High Performance Ic's
Patent: 7,396,756 →
Application: 11/845,775 →
Publication: US 2007/0293037
Top layers of metal for high performance IC's
Application: 11/893,659 →
Publication: US 2007/0288880
Top layers of metal for high performance IC's
Application: 11/930,185 →
Publication: US 2008/0083987
Top layers of metal for high performance IC's
Application: 11/930,187 →
Publication: US 2008/0048329
Top layers of metal for high performance IC's
Application: 11/930,189 →
Publication: US 2008/0083988
Top Layers of Metal for High Performance Ic's
Patent: 7,456,100 →
Application: 11/930,191 →
Publication: US 2008/0050913
Software Programmable Multiple Function Integrated Circuit Module
Patent: 8,107,311 →
Application: 12/034,668 →
Publication: US 2008/0143387
Top layers of metal for high performance IC's
Application: 12/036,306 →
Publication: US 2008/0142980
Top Layers of Metal for High Performance Ic's
Patent: 8,022,545 →
Application: 12/036,308 →
Publication: US 2008/0142981
Top layers of metal for high performance IC's
Application: 12/036,309 →
Publication: US 2008/0146020
Top Layers of Metal for High Performance Ic's
Patent: 7,863,654 →
Application: 12/203,154 →
Publication: US 2009/0045516
Related Assignments (2)
Other recorded transfers of the patents in this record — the chain of ownership.
Merger Sep 25, 2013
From: MEGICA CORPORATION
To: MEGIT ACQUISITION CORP.
Reel/Frame 031283/0198 →
Assignment of Assignor's Interest Jul 11, 2014
From: MEGIT ACQUISITION CORP.
To: QUALCOMM INCORPORATED
Reel/Frame 033303/0124 →