Top layers of metal for high performance IC's
A method of closely interconnecting integrated circuits contained within a semiconductor wafer to electrical circuits surrounding the semiconductor wafer. Electrical interconnects are held to a minimum in length by making efficient use of polyimide or polymer as an inter-metal dielectric thus enabling the integration of very small integrated circuits within a larger circuit environment at a minimum cost in electrical circuit performance.
1 . An integrated circuit chip comprising:
a silicon substrate;
multiple devices in and on said silicon substrate;
a first dielectric layer over said silicon substrate;
a metallization structure over said first dielectric layer, wherein said metallization structure comprises a first metal layer and a second metal layer over said first metal layer, and wherein said metallization structure comprises electroplated copper;
a second dielectric layer between said first and second metal layers;
a passivation layer over said metallization structure and over said first and second dielectric layers, a first opening in said passivation layer exposing a first pad of said metallization structure, a second opening in said passivation layer exposing a second pad of said metallization structure, and a third opening in said passivation layer exposing a third pad of said metallization structure, wherein said first, second and third pads are separate from one another, wherein said passivation layer comprises a topmost nitride layer of said integrated circuit chip and a topmost oxide layer of said integrated circuit chip;
a polymer layer over said passivation layer, a fourth opening in said polymer layer exposing said first pad, a fifth opening in said polymer layer exposing said second pad, and a sixth opening in said polymer layer exposing said third pad, wherein said polymer layer has a thickness between 2 micrometers and 30 micrometers and greater than those of said passivation layer, said first dielectric layer and said second dielectric layer; and
a ground distribution structure over said polymer layer and over said first, second and third pads, wherein said ground distribution structure comprises electroplated copper, wherein said first pad is connected to said second and third pads through said ground distribution structure, and said second pad is connected to said third pad through said ground distribution structure, and wherein said ground distribution structure comprises a third metal layer having a thickness greater than those of said first and second metal layers.
2 . The integrated circuit chip of claim 1 , wherein said polymer layer comprises polyimide.
3 . The integrated circuit chip of claim 1 , wherein said ground distribution structure further comprises nickel.
4 . The integrated circuit chip of claim 1 , wherein said ground distribution structure further comprises tungsten.
5 . The integrated circuit chip of claim 1 , wherein said ground distribution structure further comprises a sputtered metal.
6 . The integrated circuit chip of claim 1 , wherein said topmost nitride layer is over said topmost oxide layer.
7 . An integrated circuit chip comprising:
a silicon substrate;
multiple devices in and on said silicon substrate;
a first dielectric layer over said silicon substrate;
a metallization structure over said first dielectric layer, wherein said metallization structure comprises a first metal layer and a second metal layer over said first metal layer, and wherein said metallization structure comprises electroplated copper;
a second dielectric layer between said first and second metal layers;
a passivation layer over said metallization structure and over said first and second dielectric layers, a first opening in said passivation layer exposing a first pad of said metallization structure, a second opening in said passivation layer exposing a second pad of said metallization structure, and a third opening in said passivation layer exposing a third pad of said metallization structure, wherein said first, second and third pads are separate from one another, wherein said passivation layer comprises a topmost nitride layer of said integrated circuit chip and a topmost oxide layer of said integrated circuit chip;
a polymer layer over said passivation layer, wherein said polymer layer has a thickness between 2 micrometers and 30 micrometers and greater than those of said passivation layer, said first dielectric layer and said second dielectric layer; and
a ground distribution structure over said passivation layer and over said first, second and third pads, wherein said ground distribution structure comprises electroplated copper, wherein said first pad is connected to said second and third pads through said ground distribution structure, and said second pad is connected to said third pad through said ground distribution structure, and wherein said ground distribution structure comprises a third metal layer having a thickness greater than those of said first and second metal layers.
8 . The integrated circuit chip of claim 7 , wherein said polymer layer comprises polyimide.
9 . The integrated circuit chip of claim 7 , wherein said ground distribution structure further comprises nickel.
10 . The integrated circuit chip of claim 7 , wherein said ground distribution structure further comprises tungsten.
11 . The integrated circuit chip of claim 7 , wherein said ground distribution structure further comprises chromium.
12 . The integrated circuit chip of claim 7 , wherein said ground distribution structure further comprises aluminum.
13 . The integrated circuit chip of claim 7 , wherein said ground distribution structure further comprises a sputtered metal.
14 . The integrated circuit chip of claim 7 , wherein said ground distribution structure further comprises an electroless metal.
15 . The integrated circuit chip of claim 7 , wherein said topmost nitride layer is over said topmost oxide layer.
16 . An integrated circuit chip comprising:
a silicon substrate;
multiple devices in and on said silicon substrate;
a first dielectric layer over said silicon substrate;
a metallization structure over said first dielectric layer, wherein said metallization structure comprises a first metal layer and a second metal layer over said first metal layer, and wherein said metallization structure comprises electroplated copper;
a second dielectric layer between said first and second metal layers;
a passivation layer over said metallization structure and over said first and second dielectric layers, a first opening in said passivation layer exposing a first pad of said metallization structure, a second opening in said passivation layer exposing a second pad of said metallization structure, and a third opening in said passivation layer exposing a third pad of said metallization structure, wherein said first, second and third pads are separate from one another;
a polymer layer over said passivation layer, a fourth opening in said polymer layer exposing said first pad, a fifth opening in said polymer layer exposing said second pad, and a sixth opening in said polymer layer exposing said third pad, wherein said polymer layer has a thickness between 2 micrometers and 30 micrometers and greater than those of said passivation layer, said first dielectric layer and said second dielectric layer; and
a ground distribution structure over said polymer layer and over said first, second and third pads, wherein said ground distribution structure comprises electroplated copper, wherein said first pad is connected to said second and third pads through said ground distribution structure, and said second pad is connected to said third pad through said ground distribution structure, and wherein said ground distribution structure comprises a third metal layer having a thickness greater than those of said first and second metal layers.
17 . The integrated circuit chip of claim 16 , wherein said polymer layer comprises polyimide.
18 . The integrated circuit chip of claim 16 , wherein said ground distribution structure further comprises nickel.
19 . The integrated circuit chip of claim 16 , wherein said ground distribution structure further comprises aluminum.
20 . The integrated circuit chip of claim 16 , wherein said ground distribution structure further comprises a sputtered metal.